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參數(shù)資料
| 型號(hào)： | SMBJ58-TP |
| 廠商： | MICRO COMMERCIAL COMPONENTS |
| 元件分類： | TVS二極管 - 瞬態(tài)電壓抑制 |
| 英文描述： | 600 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA |
| 封裝： | ROHS COMPLIANT, PLASTIC, SMB, 2 PIN |
| 文件頁(yè)數(shù)： | 1/9頁(yè) |
| 文件大?。?/td> | 307K |
| 代理商： | SMBJ58-TP |
Features
For surface mount applicationsin or der to optimize
board space
Fast response time: typical less than 1.0ps from 0 volts to
VBR minimum
Low inductance
Mechanical Data
Terminals: solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes posit ive end (cathode)
except Bidirectional
Maximum soldering temperature: 260
oC for 10 seconds
Maximum Ratings @ 25
oC Unless Otherwise Specified
Peak Pulse Current on
10/1000us waveform
IPP
See Table 1 Note:
2
Peak Pulse Power
Dissipation
PPP
600W
Note:
2,
3
Peak Forward Surge
Current
IFSM)
100A
Note:
3
Operation And Storage
Temperature Range
TJ, TSTG
-55
oC to
+150
oC
Thermal Resistance
R
25
oC/W
NOTES:
2. Non-repetitive current pulse, per Fig.3 and derated above
TA=25
oC per Fig.2.
3. Mounted on 5.0mm
2 copper pads to each terminal.
4. 8.3ms, single half sine wave duty cycle=4 pulses per. Minute
maximum.
SMBJ5.0
THRU
SMBJ440CA
Transient
Voltage Suppressor
5.0 to 440 Volts
600 Watt
5. Peak pulse current waveform is 10/1000us, with maximum duty
Cycle of 0.01%.
4,5
DO-214AA
(SMB) (LEAD FRAME)
0.050”
0.106"
0.082”
SUGGESTED SOLDER
PAD LAYOUT
DIMENSIONS
INCHES
MM
DIM
MIN
MAX
MIN
MAX
NOTE
A
.083
.096
2.13
2.44
B
.075
.083
1.91
2.11
C
.002
.008
0.051
0.203
D
.006-
.012
0.152
0.305
E
.030
.050
0.76
1.27
F
.200
.220
5.08
5.59
G
.160
.185
4.06
4.70
H
.130
.155
3.30
3.94
G
H
E
D
F
A
B
C
omponents
20736 Marilla Street Chatsworth
!"#
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MCC
UL Recognized File # E331408
TM
Micro Commercial Components
www.mccsemi.com
1 of 9
Revision:
A
20
11/01/01
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
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