
Features
Mechanical Data
l
CASE: JEDEC DO-214AC
l
Terminals: solderable per MIL-STD-750, Method 2026
l
Polarity: Color band denotespositive end (cathode)
except Bidirectional
l
Maximum soldering temperature: 250
oC for 10 seconds
Maximum Ratings @ 25oC Unless Otherwise Specified
Peak Pulse Current on
10/1000us waveform
IPP
See Table 1 Note: 1
Peak Pulse Power
Dissipation
PPP
400W
Note: 1,
Peak Forward Surge
Current
IFSM)
40A
Note: 3
Operation And Storage
Temperature Range
TJ, TSTG
-55
oC to
+150
oC
NOTES:
1. Non-repetitive current pulse, per Fig.3 and derated above
TA=25
oC per Fig.2.
2. Mounted on 5.0mm
2 copper pads to each terminal.
3. 8.3ms, single half sine wave duty cycle=4 pulses per. Minute
maximum.
SMAJP4KE6.8(C)A
THRU
SMAJP4KE550(C)A
Transient
Voltage Suppressor
6.8 to 550 Volts
400 Watt
www.mccsemi.com
omponents
20736 Marilla Street Chatsworth
!"#
$% !"#
MCC
Revision: 2
2005/05/19
0.05
5”
0.085 ”
0.058 ”
SUGGESTED SOLDER
PAD LAYOUT
MA X
5”
MI N
5”
MI N
5”
DO-214AC
(SMAJ)( LEAD FRAME)
DIMENSIONS
INCHES
MM
DIM
MIN
MAX
MIN
MAX
NOTE
A
.079
.096
2.00
2.44
B
.050
.064
1.27
1.63
C
.002
.008
.05
.20
D
---
.02
---
.51
E
.030
.060
.76
1.52
F
.065
.091
1.65
2.32
G
.189
.220
4.80
5.59
H
.157
.181
4.00
4.60
J
.090
.115
2.25
2.92
H
J
E
F
G
A
B
D
C
l For surface mount applicationsin in order to optimize
boar d space
l Low profile package
l Fast response time: typical less than 1.0ps from 0 volts to
VBR minimum
l Low inductance
l UL Recognized File # E222849