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參數(shù)資料
| 型號： | SLVU2.8-4TB |
| 廠商： | Semtech Corporation |
| 英文描述： | EPD TVS⑩ Diodes Array For ESD and Latch-Up Protection |
| 中文描述： | ⑩環(huán)保署二極管陣列二極管ESD和鎖定保護(hù) |
| 文件頁數(shù)： | 4/5頁 |
| 文件大?。?/td> | 184K |
| 代理商： | SLVU2.8-4TB |
4
www.protekdevices.com
05142.R8 9/03
SLVU2.8-4
APPLICATION NOTE
Electronic equipment is susceptible to damage caused by Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), and tertiary lightning
effects. Knowing that equipment can be damaged, the SLVU2.8-4 was designed to provide the level of protection required to safe guard sensitive
equipment. This product can be used in different configurations to provide a level of protection to meet unidirectional line requirements as well as
bidirectional requirements either in a common-mode or differential-mode configuration.
UNIDIRECTIONAL DIFFERENTIAL-MODE CONFIGURATION (Figure 1)
The SLVU2.8-4 provides up to four lines of protection in a differenital-mode configuration as
depicted in figure 1.
Circuit connectivity is as follows:
Line 1 is connected to Pin 1
Line 2 is connected to Pin 7
Line 3 is connected to Pin 3
Line 4 is connected to Pin 5
Pins 2, 4, 7 and 8 are connected to ground
BIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 2)
The SLVU2.8-4 provides up to two lines of protection in a common-mode configuration as
depicted in figure 1.
Circuit connectivity is as follows:
Line 1 is connected to Pins 1 & 8
Line 2 is connected to Pins 4 & 5
Pins 2, 3, 6, and 7 are connected to ground
BIDIRECTIONAL DIFFERENTIAL-MODE CONFIGURATION (Figure 3)
The SLVU2.8-4 provides up to two-line pairs of protection in a differenital-mode configuration as
depicted in figure 1.
Circuit connectivity is as follows:
Line Pair 1 is connected to Pins 1 & 2
Line Pair 1 is connected to Pins 7 & 8
Line Pair 2 is connected to Pins 3 & 4
Line Pair 2 is connected to Pins 5 & 6
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic
Compatibility (EMC) protection. The following
guidelines are recommended:
The protection device should be placed near the
input terminals or connectors, the device will
divert the transient current immediately before it
can be coupled into the nearby traces.
The path length between the TVS device and the
protected line should be minimized.
All conductive loops including power and ground
loops should be minimized.
The transient current return path to ground
should be kept as short as possible to reduce
parasitic inductance.
Ground planes should be used whenever
possible. For multilayer PCBs, use ground vias.
Figure 2. Bidirectional Common-Mode Protection
Figure 1. Unidirectional Differential-Mode Protection
External diode to ground is a low capacitance
diode of less than 10pF
Figure 3. Bidirectional Differential-Mode Protection
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