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| 型號(hào)： | SG3546 |
| 廠商： | Microsemi Corporation |
| 英文描述： | 3.3 V UNDERVOLTAGE SENSING CIRCUIT |
| 中文描述： | 3.3V的欠壓檢測(cè)電路 |
| 文件頁數(shù)： | 2/7頁 |
| 文件大?。?/td> | 156K |
| 代理商： | SG3546 |
3.3V U
N D E R V O LT A G E
S
E N S I N G
C
I R C U I T
SG3546
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
Copyright 1994
Rev. 1.3 2/96
2
P
R O D U C T I O N
D
A T A
S
H E E T
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Input Supply Voltage (V
IN
)............................................................................... -1V to 12V
RESET Output Voltage (V
) ..........................................................................-1V to 12V
Clamp Diode Forward Current .............................................................................. 100mA
Operating Junction Temperature
Plastic (DM - Package) ......................................................................................... 150°C
Storage Temperature Range......................................................................-65°C to 150°C
Lead Temperature (Soldering, 10 seconds)............................................................ 300°C
PACKAGE PIN OUTS
RESET
INPUT
N.C.
GROUND
N.C.
N.C.
N.C.
N.C.
DM PACKAGE
(Top View)
Note 1.Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
LP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
Junction Temperature Calculation: T
= T
+ (P
x
θ
).
The
θ
numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
165°C/W
156°C/W
THERMAL DATA
BLOCK DIAGRAM
LP PACKAGE
(Top View)
3.
GROUND
2.
INPUT
1.
RESET
1.2 V
REF
INPUT
RESET
GROUND
2
1
4
1
2
3
4
8
7
6
5
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| SG3546DM | 3.3 V UNDERVOLTAGE SENSING CIRCUIT |
| SG3546LP | 3.3 V UNDERVOLTAGE SENSING CIRCUIT |
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|---|---|
| SG3546_1 | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:3.3V UNDERVOLTAGE SENSING CIRCUIT |
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