
SG143
4/90 Rev 1.1 2/94
Copyright
1994
L
IN
F
IN
ITY
Microelectronics Inc.
11861 Western Avenue
∞
∞
Garden Grove, CA 92841
(714) 898-8121
∞
FAX: (714) 893-2570
2
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Supply Voltage
SG143 ............................................................................
±
40V
Input Voltage
SG143 ............................................................................
±
40V
Differential Input Voltage .................................
±
(V
+
+ |V
-
| - 3) V
Output Short Circuit Duration............................................ 5 sec
Operating Junction Temperature
Hermetic (T, Y-Package).............................................. 150
°
C
Storage Temperature Range............................ -65°C to 150
°
C
Lead Temperature (Soldering, 10 Seconds) ................... 300
°
C
Note 1. Exceeding these ratings could cause damage to the device.
T Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................... 25°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 130°C/W
Y Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 50°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
........... 130°C/W
Note A. Junction Temperature Calculation: T
= T
+ (P
x
θ
).
Note B. The above numbers for
θ
are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The
θ
numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
Supply Voltage
SG143 ........................................................................... ±28V
Input Voltage
SG143 ........................................................................... ±28V
Operating Ambient Temperature Range (T
)
SG143 ............................................................-55
°
C to 125
°
C
RECOMMENDED OPERATING CONDITIONS
(Note 2)
Note 2. Range over which the device is functional.
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply for the operating ambient temperature of 25°C and over the recommended supply voltage
range. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.)
Units
Parameter
Input Offset Voltage
Input Offset Current
Input Bias Current
Large Signal Voltage Gain
Common-Mode Rejection
Power Supply Rejection
Input Common Mode Range (Peak)
Unity Gain Bandwidth
Slew Rate
Supply Current
Output Voltage Swing
Short Circuit Current
mV
mV
nA
nA
nA
nA
nA
V/mV
V/mV
dB
μ
V/V
V
MHz
V/
μ
s
mA
V
mA
T
A
= T
MIN
to T
MAX
T
A
= T
MAX
T
A
= T
MIN
.
T
A
= T
to T
MAX
R
L
= 100K
, V
OUT
= ±10V
T
A
= T
MIN
to T
MAX
R
L
=
5K
Test Conditions
Min.
Typ. Max.
2.0
SG143
100
50
80
±24
±22
5.0
6.0
3.0
4.5
7.0
20
35
100
4.0
1.0
8.0
180
110
15
±25
1.0
2.5
20
THERMAL DATA