參數(shù)資料
型號: SFH6752
廠商: VISHAY SEMICONDUCTORS
元件分類: 光電耦合器
英文描述: Optocoupler Logic-Out Open Drain DC-IN 2-CH 8-Pin PDIP
中文描述: High Speed Optocouplers Dual 10Mbd Hi-Speed w/Optical Photodiode
文件頁數(shù): 2/9頁
文件大?。?/td> 137K
代理商: SFH6752
www.vishay.com
2
For technical questions, contact:
optocoupleranswers@vishay.com
Document Number: 81331
Rev. 1.6, 04-Nov-10
SFH6755T, SFH6756T, SFH6757T
Vishay Semiconductors
High Speed Optocoupler, 10 MBd,
Dual, SOIC-8 Package
Notes
(1)
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
(2)
Refer to reflow profile for soldering conditions for surface mounted devices.
Note
The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the
temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of
PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay’s Thermal
Characteristics of Optocouplers application note.
ABSOLUTE MAXIMUM RATINGS
(1)
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
INPUT
TEST CONDITION
SYMBOL
VALUE
UNIT
Average forward current (single channel)
Average forward current (per channel for dual channel)
Reverse input voltage
Surge current
Output power dissipation (single channel)
Output power dissipation (per channel for dual
OUTPUT
Supply voltage
Output current
Output voltage
Output power dissipation (single channel)
Output power dissipation (for dual channel)
COUPLER
Isolation test voltage
Storage temperature
Operating temperature
Lead solder temperature
Solder reflow temperature
(2)
I
F
I
F
V
R
I
FSM
P
diss
P
diss
20
15
5
200
35
25
mA
mA
V
mA
mW
mW
t = 100 μs
1 min maximum
V
CC
I
O
V
O
P
diss
P
diss
7
V
50
7
85
60
mA
V
mW
mW
t = 1 s
V
ISO
T
stg
T
amb
4000
V
RMS
°C
°C
°C
°C
- 55 to + 150
- 40 to + 100
260
260
for 10 s
for 1 min
T
sld
RECOMMENDED OPERATING CONDITIONS
PARAMETER
Operating temperature
Supply voltage
Input current low level
Input current high level
Output pull up resistor
Fanout
TEST CONDITION
SYMBOL
T
amb
V
CC
I
FL
I
FH
R
L
N
MIN.
- 40
4.5
0
5
330
MAX.
100
5.5
250
15
4K
5
UNIT
°C
V
μA
mA
Ω
-
R
L
= 1 k
Ω
THERMAL CHARACTERISTICS
PARAMETER
LED power dissipation
TEST CONDITION
at 25 °C
SYMBOL
P
diss
P
diss
T
jmax
T
jmax
θ
EE
θ
DE
θ
EB
θ
DB
θ
EC
VALUE
100
UNIT
mW
Output power dissipation
at 25 °C
500
mW
Maximum LED junction temperature
125
°C
Maximum output die junction temperature
125
°C
Thermal resistance, junction emitter to emitter
412
°C/W
Thermal resistance, junction detector to emitter
133
°C/W
Thermal resistance, junction emitter to board
120
°C/W
Thermal resistance, junction detector to board
77
°C/W
Thermal resistance, junction emitter to case
110
°C/W
20510
θ
ET
T
E1
T
D
T
C
θ
EE
θ
EB
θ
DB
θ
DE
T
B
T
B
T
B
T
C
T
E2
θ
DE
θ
EB
θ
ET
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