參數(shù)資料
型號: SFH6345-X017
廠商: VISHAY SEMICONDUCTORS
元件分類: 光電耦合器
英文描述: Optocoupler - IC Output, 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 1 Mbps, PLASTIC, SMD, 8 PIN
中文描述: High Speed Optocouplers 1Mbd High-Speed Trans Out CTR>30%
文件頁數(shù): 2/7頁
文件大?。?/td> 172K
代理商: SFH6345-X017
SFH6345
www.vishay.com
Vishay Semiconductors
Rev. 2.1, 09-Mar-12
2
Document Number: 83680
For technical questions, contact:
optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc91000
Notes
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
(1)
Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through
hole devices (DIP)
Notes
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering
evaluation. Typical values are for information only and are not part of the testing requirements.
(1)
T
amb
= 0 °C to 70 °C, unless otherwise specified, typical values T
amb
= 25 °C.
ABSOLUTE MAXIMUM RATINGS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
INPUT
Reverse voltage
DC forward current
Surge forward current
t
p
= 1 μs, 300 pulses/s
Power dissipation
OUTPUT
Supply voltage
Output voltage
Output current
Power dissipation
COUPLER
Isolation test voltage
between emitter and detector
V
IO
= 500 V, T
amb
= 25 °C
V
IO
= 500 V, T
amb
= 100 °C
Storage temperature range
Ambient temperature range
Junction temperature
max. 10 s, max. dip soldering:
distance to seating plane
1.5 mm
TEST CONDITION
SYMBOL
VALUE
UNIT
V
R
I
F
I
FSM
P
diss
3
V
25
1
45
mA
A
mW
V
S
V
O
I
O
P
diss
- 0.5 to 30
- 0.5 to 25
8
100
V
V
mA
mW
V
ISO
5300
V
RMS
Isolation resistance
R
IO
R
IO
T
stg
T
amb
T
j
10
12
10
11
Ω
Ω
°C
°C
°C
- 55 to + 150
- 55 to + 125
100
Soldering temperature
(1)
T
sld
260
°C
ELECTRICAL CHARACTERISTICS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
INPUT
(1)
Forward voltage
I
F
= 16 mA
Reverse current
Capacitance
V
R
= 0 V, f = 1 MHz
Thermal resistance
OUTPUT
SYMBOL
MIN.
TYP.
MAX.
UNIT
V
F
I
R
C
O
R
thja
1.33
0.5
30
700
1.9
10
V
μA
pF
K/W
V
R
= 3 V
Supply current, logic high
I
F
= 0 V, V
O
= open, V
CC
= 15 V
I
CCH
I
CCH
I
OH
I
OH
I
OH
C
CE
R
thja
0.01
0.01
0.003
0.01
1
2
μA
μA
μA
μA
μA
pF
K/W
Output current, output high
I
F
= 0 V, V
O
= V
CC
= 5.5 V
0.5
1
50
I
F
= 0 V, V
O
= V
CC
= 15 V
Collector emitter capacitance
Thermal resistance
COUPLER
Coupling capacitance
V
CE
= 5 V, f = 1 MHz
3
300
C
C
0.6
pF
Collector emitter saturation voltage
I
F
= 16 mA, I
= 2.4 mA,
V
CC
= 4.5 V
I
F
= 16 mA, V
O
= open, V
CC
= 15 V
V
OL
0.1
0.4
V
Logic low supply current
I
CCL
80
200
μA
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