
SFH6325, SFH6326
Vishay Semiconductors
www.vishay.com
Rev. 1.7, 06-Jul-11
2
Document Number: 83679
For technical questions, contact:
optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc91000
Notes
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
(1)
Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through
hole devices (DIP).
Notes
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering
evaluation. Typical values are for information only and are not part of the testing requirements.
(1)
T
amb
= 0 °C to 70 °C, unless otherwise specified.
(2)
To measure crosstalk, turn on the LED for channel 1 and the output current for channel 2 in logic high. Repeat for channel 2.
OUTPUT
Supply voltage
Output voltage
Collector output current
Derate linearly from 25 °C
Power dissipation
COUPLER
Isolation test voltage
Pollution degree (DIN VDE0109)
Creepage distance
Clearance distance
Derate linearly from 25 °C
Total package dissipation
Comparative tracking index per DIN
IEC112/VDE0303 part 1, group IIIa per DIN VDE6110
V
S
V
O
I
CO
- 0.5 to 30
- 0.5 to 25
8
1.33
50
V
V
mA
mW/°C
mW
T
amb
70 °C
P
diss
t = 1 s
V
ISO
5300
7
7
1.93
145
V
RMS
mm
mm
mW/°C
mW
P
tot
175
Isolation resistance
V
IO
= 500 V, T
amb
= 25 °C
V
IO
= 500 V, T
amb
= 100 °C
R
IO
R
IO
T
stg
T
amb
10
12
10
11
°C
°C
Storage temperature range
Ambient temperature range
- 55 to + 125
- 55 to +100
Soldering temperature
(1)
max. 10 s, dip soldering distance
to seating plane
1.5 mm
T
sld
260
°C
ELECTRICAL CHARACTERISTICS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
INPUT
(1)
Forward voltage
Breakdown voltage
Reverse current
Capacitance
Temperature coefficient of forward voltage
OUTPUT
Logic low supply current
I
F
= 16 mA, V
O
= open, V
CC
= 4.5 V
Supply current, logic high
I
F
= 0 mA, V
O
= open, V
CC
= 15 V
I
F
= 16 mA, V
CC
= 4.5 V, I
O
= 1.1 mA SFH6325
I
F
= 16 mA, V
CC
= 4.5 V, I
O
= 3 mA
I
F
= 0 mA, V
O
= V
CC
= 5.5 V
I
F
= 0 mA, V
O
= V
CC
= 15 V
Channel to channel
(2)
crosstalk
I
F
= 16 mA, V
O
= V
CC
= 5.5 V
COUPLER
Capacitance (input to output)
TEST CONDITION
PART
SYMBOL
MIN.
TYP.
MAX.
UNIT
I
F
= 16 mA
I
R
= 10 μA
V
R
= 4.5 V
V
R
= 0 V, f = 1 MHz
I
F
= 16 mA
V
F
V
BR
I
R
C
O
1.33
1.9
V
V
μA
pF
4.5
0.5
30
- 1.7
10
V
F
/
T
amb
mV/°C
I
CCL
I
CCH
V
OL
V
OL
I
OH
I
OH
I
OH-XT
100
0.01
0.1
0.1
3
200
4
0.5
0.5
500
50
500
μA
μA
V
V
nA
μA
nA
Logic low output voltage
SFH6326
Logic high output current
f = 1 MHz
C
IO
0.6
pF
ABSOLUTE MAXIMUM RATINGS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT