參數(shù)資料
型號(hào): SFC05-4.TM
元件分類: TVS二極管 - 瞬態(tài)電壓抑制
英文描述: 300 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MO-211BB
封裝: FLIP CHIP, CSP-6
文件頁數(shù): 5/8頁
文件大?。?/td> 190K
代理商: SFC05-4.TM
5
2003 Semtech Corp.
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
SFC05-4
Device Connection Options
The SFC05-4 has solder bumps located in a 3 x 2
matrix layout on the active side of the device. The
bumps are designated by the numbers 1 - 3 along the
horizontal axis and letters A - B along the vertical axis.
The lines to be protected are connected at bumps A1,
B1, A3, and B3. Bumps A2 and B2 are connected to
ground. All path lengths should be kept as short as
possible to minimize the effects of parasitic inductance
in the board traces.
Wafer Level CSP TVS
CSP TVS devices are wafer level chip scale packages.
They eliminate external plastic packages and leads and
thus result in a significant board space savings. Manu-
facturing costs are minimized since they do not require
an intermediate level interconnect or interposer layer
for reliable operation. Their compatibility with current
pick and place equipment further reduces manufactur-
ing costs. Certain precautions and design consider-
ations have to be observed, however, for maximum
solder joint reliability. These include solder pad defini-
tion, board finish, and assembly parameters.
Printed Circuit Board Mounting
Non-solder mask defined (NSMD) land patterns are
recommended for mounting the SFC05-4. Solder
mask defined (SMD) pads produce stress points near
the solder mask on the PCB side that can result in
solder joint cracking when exposed to extreme fatigue
conditions. The recommended pad size is 0.225 ±
0.010 mm with a solder mask opening of 0.350 ±
0.025 mm.
Grid Courtyard
The recommended grid placement courtyard is 1.3 x
1.8 mm. The grid courtyard is intended to encompass
the land pattern and the component body that is
centered in the land pattern. When placing parts on a
PCB, the highest recommended density is when one
courtyard touches another.
Applications Information
Device Schematic and Pin Configuration
Layout Example
NSMD Package Footprint
To Protected IC
To Connector
Ground
相關(guān)PDF資料
PDF描述
SFC05-4.WFT 300 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MO-211BB
SFC05-4.WMT 300 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MO-211BB
SFC05-5-T710-2 250 W, UNIDIRECTIONAL, 5 ELEMENT, SILICON, TVS DIODE
SFC05-5.WMT 200 W, UNIDIRECTIONAL, 5 ELEMENT, SILICON, TVS DIODE, MO-211BB
SFF1605G 16 A, 300 V, SILICON, RECTIFIER DIODE, TO-220AB
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