參數(shù)資料
型號(hào): SF2008PT
元件分類: 整流器
英文描述: 20 A, 600 V, SILICON, RECTIFIER DIODE, TO-247AD
封裝: LEAD FREE, PLASTIC, TO-3P, 3 PIN
文件頁(yè)數(shù): 1/3頁(yè)
文件大?。?/td> 980K
代理商: SF2008PT
Voltage
200 to 600 V
Current
20 A
May - 08
VF
Maximum Instantaneous Forward Voltage @ 10A
@ 20 A
IR
Rthj-c
Typical Thermal Resistance (See Note)
Maximum Recurrent Peak Reverse Voltage (V)
Maximum RMS Voltage (V)
Maximum DC Blocking Voltage (V)
VRRM
VRMS
VDC
IF (AV)
– 55 to + 150 °C
IFSM
20 A
180 A
400
280
400
Cj
SF
2006PT
SF2004PT ........ SF2008PT
Absolute Maximum Ratings, according to IEC publication No. 134
Electrical Characteristics
TO-3P/TO-247AD
600
420
600
SF
2008PT
20 Amp. Glass Passivated Ultrafast Rectifiers
200
140
200
SF
2004PT
0.95 V
1.3 V
10 A
400 A
2.5 °C/W
1
2
3
Maximum Average Forward Rectified
Current at TC = 100 °C
Peak Forward Surge Current 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC Method)
1.7 V
Maximum DC Reverse Current @ TC = 25 C
at Rated DC Blocking Voltage @ TC = 100 C
Typical Junction Capacitance at 1MHz
and reverse voltage of 4VDC
175 pF
Note: Thermal Resistance from Junction to Case Mount on Heatsink size 76.2mm x 127mm x 6.35 mm Al-Plate.
Dual rectifier construction, positive center-tap
Plastic package has Underwriters Laboratory
Flammability Classifications 94V-0
Glass passivated chip junctions
Superfast recovery time, high voltage
Low forward voltage, high current capability
Low thermal resistance
Low power loss, high efficiency
High temperature soldering guaranteed:
260 °C/10 seconds, 4.06mm lead lengths
at 5 Ibs. (2.3Kg) tension
Cases: JEDEC TO-3P/TO-247AD molded plastic
Terminals: Pure tin plated, lead free solderable per
MIL-STD-750, Method 2026
Polarity: As marked
Mounting position: Any
Mechanical Data
Weight: 0.2 ounce, 5.6 grams
SF
2006PT
SF
2008PT
SF
2004PT
1.1 V
1.5 V
1.9 V
35 nS
Maximum Reverse Recovery Time
IF =0.5 A; IR = 1 A; IRR = 0.25 A
Trr
Tj
-Tstg Operating Junction Temperature and Storage
Temperature
Tj = 25 °C
PIN 1
PIN 3
CASE
PIN 2
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