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參數(shù)資料
| 型號： | SE-FG324-H |
| 元件分類： | 插座 |
| 英文描述： | BGA324, IC SOCKET |
| 文件頁數(shù)： | 3/4頁 |
| 文件大?。?/td> | 1046K |
| 代理商： | SE-FG324-H |
Ball / Land Grid Array Sockets
Screw Lock Type
E-tec
the Swiss connection
E-tec is now the leading BGA socket manufacturer.
Sockets range from 5 x 5 upwards contacts with even larger parts
currently in design. Some of the existing patterns are shown on the
following pages, many more exist and your exact requirements can easily
be added to our extensive product library. The SMD socket is simply
placed and reflowed onto the PCB in the same way as the chip and
occupies only a small amount of additional board space. The screw lock
socket extends ≈ 6,00 mm beyond the outer ballrow with no fixing holes.
We aim to solve your requirements - many different terminals and
configurations are available. Your custom sets our standards!
Please note, we will always request the chip data
to ensure we offer a compatible socket.
SMT Style
PCB Pad Layout
0,70mm/.028“ if pitch 1,27mm
0,60mm/.023“ if pitch 1,00mm
0,50mm/.019“ if pitch 0,80mm
dimensions if BGA Socket pitch 1,27mm with contact type 30
Soldertail Style
Soldertail:
0,45mm/.017“ if pitch 1,27mm
0,45mm/.017“ if pitch 1,00mm
0,40mm/.015“ if pitch 0,80mm
PCB Hole Layaut
PCB Hole:
0,60mm/.024“ if pitch 1,27mm
0,60mm/.024“ if pitch 1,00mm
0,55mm/.021“ if pitch 0,80mm
The pitch dimension depends on your Ball Grid Array
Specifications
Mechanical data
Contact life
Retention System life
Solderability
Individual contact force
Max. torque for retention screws
Material
Insulator
Terminal
Contact
Electrical data
Contact resistance
Current rating
Insulation resistance at 500V DC
Breakdown voltage at 60 Hz
Inductance
Operating temperature
100000 cycles min.
100 cycles min.
exceeds MIL-STD-202 Method 208
40 grams max.
7 cN per meter, or 10oz per inch
Glass Epoxy FR 4
Brass
BeCu
< 30 m
1 A max.
>104
M
1 KV min.
< 5 nH
55°C to +130°C ; 220°C for 10 sec.
How to order
X X W x x x x - x x x x - x x X X x x
Device Type
Device Material
Pitch
Grid Code Config Code
Plating
B = Ball Grid
L = Land Grid
C = Column Grid
C
=
Ceramic
P
=
Plastic
07 = 0,75mm
08 = 0,80mm
10 = 1,00mm
12 = 1,27mm
15 = 1,50mm
please refer to
the footprint
pages
42 to 50
will be given by
the factory after
receipt of the chip
datasheet
01 = tin/gold
Nbr of contacts
Contact Type
refer to the next pages
30 = standard SMD ( A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm & 0,80mm pitch )
29 = raised SMD
( A“ = 5,00mm; other dim. on request )
70 = solder tail
( A“ = 3,30mm if 1,27mm pitch; 2,80mm if 1,00mm & 0,80mm pitch )
EP patents 0829188, 0897655
Patents pending in other countries.
38
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