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參數(shù)資料
| 型號(hào)： | SDV1005-600 |
| 英文描述： | 600W RMS,Class D Audio Amplifier Module(600W RMS,D級(jí)音頻放大器模塊) |
| 中文描述： | 600W額定功率，D類音頻放大器模塊（600W額定功率，?級(jí)音頻放大器模塊） |
| 文件頁(yè)數(shù)： | 6/10頁(yè) |
| 文件大小： | 121K |
| 代理商： | SDV1005-600 |
Semelab Plc. reserve the right to change the products shown on this datasheet in the interest of improved specification. No responsibility is assumed for
the use of information contained herein, nor for any infringement of patent or rights of others that may result from such use. No license is granted by
implication or otherwise under any patent or patent right of Semelab Plc.
THERMAL EFFICIENCY
The SDV1005-600 amplifier module comes housed in an aluminium package.
Internal to the package, the power components are thermally bonded to the housing.
The housing is also electrically bonded to the supply ground. The thermal resistance
of the amplifier package in free air is 3
°
C/W (
θ
a
). The contact thermal resistance of
the amplifier can be assumed to be 0.5
°
C/W (
θ
c
).
To decide whether additional heatsinking is required the power level and duty cycle of the music must be
estimated. The power level should be determined from the maximum power the unit is asked to produce and
is determined by the rail voltage (see above chart of rail voltage versus power into a 4
load). Assuming an
inherent efficiency
of 95% means that 5% of the rated power will be dissipated inside the amplifier module.
For example, a maximum
theoretical output power
of 600W, 30W will be dissipated inside the amplifier
unit. This assumes a continuous sine wave input at full
modulation factor
, somewhat unrealistic for audio
signals with their associated
latency
. The actual power levels with audio signals would typically be 25% of
the calculated value. If this figure is used then the power dissipation inside the module would be 7.5W.
Once the typical power dissipated inside the module is known the temperature rise using the module at
this power can be calculated. The temperature rise is given by:
Temperature rise =
θ
a
* power dissipation
(
°
C)
With the example above, the temperature rise would be 22.5
°
C above ambient temperature. The
operational temperature of the module should not exceed 70
°
C. If the calculated temperature rise and the
maximum ambient temperature for operation will exceed this figure, then additional heatsinking will be
required. If heatsinking is required then the module can be mounted onto an additional heatsink. When
mounting to a heatsink, it is recommended that a high thermal conductivity electrical insulating mat is used.
If the thermal resistance of the new heatsink is
θ
h
, then:
Temperature rise = (
θ
c
+
θ
h
) * power dissipation
(
°
C)
If a heatsink with a thermal resistance of 1.5
°
C/W is selected, then in the above example the temperature
rise above ambient would be 15
°
C.
INPUT CHARACTERISTICS
The input impedance of the standard amplifier module is 7.3K
. This value was chosen to provide the
best balance between ensuring sufficient impedance to the audio source and minimising the affects of
external interference. The amplifier input is differential to ensure common mode noise rejection. The
bandwidth of the input amplifier is 100KHz (3dB). This wide bandwidth is designed to afford maximum
flexibility to the user. For purely audio applications, an input filter can be incorporated prior to the amplifier
module. This additional circuitry can be incorporated as an option inside the amplifier package or
alternatively can be configured external to the amplifier. For further discussions of these options, please
contact Magnatec.
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