
Lead-free Green
DS30392 Rev. 6 - 2
1 of 3
SDM03U40
www.diodes.com
Diodes Incorporated
SDM03U40
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
Low Forward Voltage Drop
Guard Ring Die Construction for
Transient Protection
Ideal for low logic level applications
Low Capacitance
Lead Free by Design/RoHS Compliant (Note 1)
"Green" Device, Note 4 and 5
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOD-523
Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: Cathode Band
Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
Marking Code: LK
Ordering Information: See Last Page
Weight: 0.002 grams (approximate)
Maximum Ratings
@ T
A
= 25 C unless otherwise specified
Characteristic
Symbol
V
RM
V
R
V
R(RMS)
I
O
Value
40
30
21
30
Unit
V
V
V
mA
Peak Reverse Voltage
DC Reverse Voltage
RMS Reverse Voltage
Average Rectified Current
Non-Repetitive Peak Forward Surge Current @8.3ms
Single half sine-wave superimposed on rated load
I
FSM
200
mA
Electrical Characteristics
Characteristic
Symbol
V
(BR)R
V
F
I
R
C
T
Min
40
Typ
Max
Unit
V
mV
A
pF
Test Conditions
I
R
= 10uA
I
F
= 1mA
V
R
= 30V
V
R
= 1V, f = 1.0 MHz
Reverse Breakdown Voltage (Note 3)
Forward Voltage
Peak Reverse Current (Note 3)
Total Capacitance
290
370
0.5
2
@ T
A
= 25 C unless otherwise specified
B
A
C
D
G
E
CATHODE MARK
L
MARKING CODE
SOD-523
Min
Dim
A
B
C
D
E
G
All Dimensions in mm
Max
1.50
1.70
1.10
1.30
0.25
0.35
0.70
0.90
0.10
0.20
0.55
0.65
Note: 1. No purposefully added lead.
2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website
at http://www.diodes.com/datasheets/ap02001.pdf. T
A
= 25 C.
3. Short duration pulse test used to minimize self-heating effect.
4. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with date code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date
code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
Thermal Characteristics
Characteristic
Symbol
P
d
R
JA
T
j,
T
STG
Value
150
667
-40 to +125
Unit
mW
C/W
C
Power Dissipation (Note 2)
Thermal Resistance, Junction to Ambient (Note 2)
Operating and Storage Temperature Range