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參數(shù)資料
| 型號： | SD-14553FX-294W |
| 廠商： | DATA DEVICE CORP |
| 元件分類： | 位置變換器 |
| 英文描述： | SYNCHRO OR RESOLVER TO DIGITAL CONVERTER, CDMA34 |
| 封裝： | CERAMIC, FP-34 |
| 文件頁數(shù)： | 10/12頁 |
| 文件大?。?/td> | 115K |
| 代理商： | SD-14553FX-294W |
7
Data Device Corporation
www.ddc-web.com
SD-14550 Series
Rev. H
0.780 MAX
(19.81)
0.400
(10.16)
0.800
(20.32)
INDEX
DENOTES
PIN 1
0.210 MAX (5.33)
1.0 MAX
(25.4)
0.700
(17.78)
0.160 MIN
(4.064)
0.050
(1.27)
0.100 TYP
(2.54)
0.050 TYP
(1.27)
0.600
(15.24)
0.018
DIA TYP
(0.46)
16
17
18
19
33
34
2
1
3
32
20
15
NUMBERS FOR
REFERENCE ONLY
0.008
(0.20)
0.05
(1.27)
16 EQ. SP. @
0.050 = 0.80
TOL NONCOM TYP
(1.24 = 20.32)
SEE NOTE 2
0.500 MIN TYP
(12.7)
0.100 ±0.010 TYP
(2.54 ±0.25)
0.210 MAX (5.33)
27
28
1
34
0.780 MAX
(19.81)
PIN 1 DENOTED BY
INDEX MARK
1.000 MAX
(25.4)
0.010 ±0.002 TYP
(0.25 ±0.05)
PIN NUMBERS FOR
REFERENCE ONLY
0.018 ±0.002 TYP
(0.46 ±0.05)
0.050 TYP
(1.27)
0.020 R TYP
(0.51)
FIGURE 8. SD-14550 MECHANICAL OUTLINE
(FLAT PACK)
FIGURE 7. SD-14550 MECHANICAL OUTLINE
(DIP)
Notes:
1. (S) = Synchro; (R) = Resolver; (D) = 2 V Resolver Direct.
2. Connect (close to the hybrid) pin 31 to pin 7.
3. Connect a 33 F/10 VDC tantalum filter cap from pin 5 to pin 7.
Bit 5
Bit 13
18
19
Bit 12 (LSB, 12-bit mode)
Bit 4
17
16
Bit 6
20
Bit 11
15
Bit 14 (LSB, 14-bit mode)
21
Bit 3
14
Bit 7
22
Bit 10 (LSB, 10-bit mode)
13
Bit 15
23
Bit 2
12
Bit 8
24
Bit 9
11
Bit 16 (LSB, 16-bit mode)
25
Bit 1 (MSB)
10
EL (Enable LSBs)
26
BIT (Built-In-Test)
9
A (Resolution Control A)
27
EM (Enable MSBs)
8
B (Resolution Control B)
28
GND (ground)
7
INH (Inhibit)
29
+5 V (Power Supply)
6
VEL (Velocity Output)
30
Filter Point
5
AGND (Analog Ground)
31
N.C.
S4 (R)
4
N.C.
32
SIN (D)
S3 (S)
S3 (R)
3
RL (-Reference input)
33
COS (D)
S2 (S)
S2 (R)
2
FUNCTION
RH (+Reference input)
PIN
34
N.C.
S1 (S)
S1 (R)
PIN
FUNCTION
1
TABLE 5. PINOUTS (DIP AND FLAT PACK)
Notes:
1. Dimensions are in inches (mm).
2. Lead identification numbers are for reference only
3. Lead cluster shall be centered within ±0.005 (0.13) of outline dimensions.
Lead spacing dimensions apply only at seating plane.
4. Pin material meets solderability requirements to MIL-STD-202E, Method 208C.
5. Case is hermetically sealed ceramic package.
Notes:
1. Dimensions are in inches (mm).
2. Lead cluster shall be centralized about case centerline within ±0.010 (±2.54).
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