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參數(shù)資料
| 型號： | SCD5583A |
| 廠商： | INFINEON TECHNOLOGIES AG |
| 英文描述： | 8-Character 5 x 5 Dot Matrix Serial Input Dot Addressable Intelligent Display |
| 中文描述： | 8個字符的5 × 5點陣串行輸入點可尋址智能顯示 |
| 文件頁數(shù)： | 9/15頁 |
| 文件大?。?/td> | 437K |
| 代理商： | SCD5583A |
2000 In
fi
neon Technologies Corp.
Optoelectronics Division
San Jose, CA
www.in
fi
neon.com/opto
1-888-In
fi
neon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG
Regensburg, Germany
www.osram-os.com
+49-941-202-7178
SCD5580/1/2/3/4 A
9
March 23, 2000-18
Figure 10. Row Strobing
Multiplexer and Display Driver
The eight characters are row multiplexed with RAM resident
column data. The strobe rate is established by the internal or
external MUX Clock rate. The MUX Clock frequency is divided
by a 320 counter chain. This results in a typical strobe rate of
750 Hz. By pulling the Clock SEL line low, the display can be
operated from an external MUX Clock. The external clock is
attached to the CLK I/O connection (pin 15). The maximum
external MUX Clock frequency should be limited to 1.0 MHz.
An asynchronous hardware Reset (pin 13) is also provided.
Bringing this pin low will clear the Character Address Register,
Control Word Register, RAM, and blanks the display. This
action leaves the display set at Character Address 0, and the
Brightness Level set at 100%.
Thermal Considerations
The SCD558XA has been designed to provide lowest thermal
resistance from the CMOS to the ground pin.
The heat is then conducted through the traces on the users cir-
cuit board to free air. The max. IC operating temperature is
125
°
C. Maximum. IC junction temperature is calculated using
the following equation:
T
J
(IC) Max.=
T
A
+(P
D
Max.) (R
θ
J-PIN
+R
θ
PIN-A
)
where R
θ
J-PIN
=35
°
C/W.
P
D
Max.=
V
CC
Max.x
I
CC
Max
=5.5 Vx0.240=1.32 W.
R
θ
PIN-A
will depend on ground trace thickness, whether parts
are soldered to the pcb or socketed and on air circulation.
Electrical & Mechanical Considerations
Interconnect Considerations
Optimum product performance can be had when the following
electrical and mechanical recommendations are adopted. The
SCD558XA’s ICs are constructed in a high speed CMOS pro-
cess, consequently high speed noise on the SERIAL DATA,
SERIAL DATA CLOCK, LOAD and RESET lines may cause
incorrect data to be written into the serial shift register. Adhere
to transmission line termination procedures when using fast
line drivers and long cables (>10 cm).
Good digital grounds (pins 14, 28) and power supply decoupling
(pins 6, 9, 20, 23) will insure that
I
CC
(<400 mA peak) switching
currents do not generate localized ground bounce. Therefore it
is recommended that each display package use a 0.1
μ
F and
20
μ
F capacitor between
V
CC
and ground.
When the internal MUX Clock is being used, connect the
CLKSEL pin to
V
CC
and leave CLK I/O floating. In those applica-
Row 0
Row 1
Row 2
Row 3
Row 4
0 1 2 3 4
Columns
Row 0
Row 1
Row 2
Row 3
Row 4
0 1 2 3 4
Columns
Row 0
Row 1
Row 2
Row 3
Row 4
0 1 2 3 4
Columns
Row 0
Row 1
Row 2
Row 3
Row 4
0 1 2 3 4
Columns
Row 0
Row 1
Row 2
Row 3
Row 4
0 1 2 3 4
Columns
ROW LOAD LOAD ROW 0 LOAD ROW 1 LOAD ROW 2 LOAD ROW 3 LOAD ROW 4
tions where RESET will not be connected to the system’s reset
control, it is recommended that this pin be connected to the
center node of a series 0.1,
μ
F and 100 k
RC network. Thus
upon initial power up the RESET will be held low for 10 ms
allowing adequate time for the system power supply to stabilize.
ESD Protection
The input protection structure of the SCD558XA provides sig-
nificant protection against ESD damage. It is capable of with-
standing discharges greater than 2.0 kV. Take all the standard
precautions, normal for CMOS components. These include
properly grounding personnel, tools, tables, and transport carri-
ers that come in contact with unshielded parts. If these condi-
tions are not, or cannot be met, keep the leads of the device
shorted together or the parts in anti-static packaging.
Soldering Considerations
The SCD558XA can be hand soldered with SN63 solder using a
grounded iron set to 260
°
C.
Wave soldering is also possible following these conditions: Pre-
heat that does not exceed 93
°
C on the solder side of the PC
board or a package surface temperature of 85
°
C. Water soluble
organic acid flux (except carboxylic acid) or rosin-based RMA
flux without alcohol can be used.
Wave temperature of 245
°
C ±5
°
C with a dwell between 1.5 sec.
to 3.0 sec. Exposure to the wave should not exceed tempera-
tures above 260
°
C for five seconds at 0.063" below the seating
plane. The packages should not be immersed in the wave.
Post Solder Cleaning Procedures
The least offensive cleaning solution is hot D.I. water (60 C) for
less than 15 minutes. Addition of mild saponifiers is acceptable.
Do not use commercial dishwasher detergents.
For faster cleaning, solvents may be used. Exercise care in
choosing solvents as some may chemically attack the nylon
package. Maximum exposure should not exceed two minutes at
elevated temperatures. Acceptable solvents are TF (trichlorotrif-
luorethane), TA, 111 Trichloroethane, and unheated acetone.
Note:
1)
Acceptable commercial solvents are: Basic TF, Arklone, P. Genesolv,
D. Genesolv DA, Blaco-Tron TF, Blaco-Tron TA, and Freon TA.
Unacceptable solvents contain alcohol, methanol, methylene
chloride, ethanol, TP35, TCM, TMC, TMS+, TE, or TES. Since
many commercial mixtures exist, contact a solvent vendor for
chemical composition information. Some major solvent manu-
facturers are: Allied Chemical Corporation, Specialty Chemical
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