參數(shù)資料
型號(hào)： SC16IS762IPW-S
廠商： NXP Semiconductors
文件頁(yè)數(shù)： 51/60頁(yè)
文件大?。?/td> 0K
描述： IC UART DUAL I2C/SPI 28-TSSOP
標(biāo)準(zhǔn)包裝： 63
特點(diǎn)： 低電流
通道數(shù)： 2，DUART
FIFO's： 64 字節(jié)
規(guī)程： RS232，RS485
電源電壓： 2.5V, 3.3V
帶自動(dòng)流量控制功能： 是
帶故障啟動(dòng)位檢測(cè)功能： 是
帶調(diào)制解調(diào)器控制功能： 是
安裝類型： 表面貼裝
封裝/外殼： 28-TSSOP（0.173"，4.40mm 寬）
供應(yīng)商設(shè)備封裝： 28-TSSOP
包裝： 管件
配用： 568-4000-ND - DEMO BOARD SPI/I2C TO DUAL UART
568-3510-ND - DEMO BOARD SPI/I2C TO UART
其它名稱： 568-2241
SC16IS752_SC16IS762
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 9 — 22 March 2012
55 of 60
NXP Semiconductors
SC16IS752; SC16IS762
Dual UART with I2C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 39) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 40 and 41
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 39.
Table 40.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
Table 41.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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參數(shù)描述
SC16IS762IPW-T 功能描述:IC UART DUAL I2C/SPI 28-TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - UART（通用異步接收器/發(fā)送器） 系列:- 標(biāo)準(zhǔn)包裝:250 系列:- 特點(diǎn):* 通道數(shù):2，DUART FIFO's:16 字節(jié) 規(guī)程:RS232，RS485 電源電壓:2.25 V ~ 5.5 V 帶并行端口:- 帶自動(dòng)流量控制功能:是 帶IrDA 編碼器/解碼器:是 帶故障啟動(dòng)位檢測(cè)功能:是 帶調(diào)制解調(diào)器控制功能:是 帶CMOS:是 安裝類型:表面貼裝 封裝/外殼:48-TQFP 供應(yīng)商設(shè)備封裝:48-TQFP（7x7） 包裝:托盤 其它名稱:XR16L2551IM-F-ND
SC16IS850LIBS,128 功能描述:UART 接口集成電路 UART/12C-BUS/ SPI INTERF.128 FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16IS850LIBS,151 功能描述:UART 接口集成電路 UART/12C-BUS/ SPI INTERF.128 FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16IS850LIBS,157 功能描述:UART 接口集成電路 UART/12C-BUS/ SPI INTERF.128 FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16IS850LIPW,118 制造商:NXP Semiconductors 功能描述:Single UART with I2C-bus/SPI interface 制造商:NXP Semiconductors 功能描述:SC16IS850LIPW/TSSOP24/REEL13// - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC INTERFACE UART
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