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參數(shù)資料
| 型號： | SC16C750BIBS,151 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 33/44頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC UART SINGLE W/FIFO 32-HVQFN |
| 產(chǎn)品培訓模塊： | Stand-Alone UARTs |
| 標準包裝： | 490 |
| 通道數(shù)： | 1，UART |
| FIFO's： | 64 字節(jié) |
| 電源電壓： | 2.5V，3.3V，5V |
| 帶自動流量控制功能： | 是 |
| 帶故障啟動位檢測功能： | 是 |
| 帶調制解調器控制功能： | 是 |
| 帶CMOS： | 是 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-VFQFN 裸露焊盤 |
| 供應商設備封裝： | 32-HVQFN（5x5） |
| 包裝： | 托盤 |
| 產(chǎn)品目錄頁面： | 828 (CN2011-ZH PDF) |
| 其它名稱： | 568-3285 935276388151 SC16C750BIBS-S |
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SC16C750B_5
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 17 October 2008
39 of 44
NXP Semiconductors
SC16C750B
5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs
12. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reow
soldering description”.
12.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
12.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
Board specications, including the board nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
12.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| SC16C750BIBS-F | 功能描述:UART 接口集成電路 16CB 2.5V-5V 1CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C750BIBS-S | 制造商:NXP Semiconductors 功能描述:UART 1-CH 64Byte FIFO 2.5V/3.3V/5V 32-Pin HVQFN EP Tray |
| SC16C750IA44 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Asynchronous Receiver/Transmitter (UART) with 64-byte FIFO |
| SC16C750IA44,512 | 功能描述:UART 接口集成電路 16C 2.5V-5V 1CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C750IA44,518 | 功能描述:UART 接口集成電路 16C 2.5V-5V 1CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
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