參數(shù)資料
型號(hào)： SC16C554IB64,151
廠商： NXP Semiconductors
文件頁(yè)數(shù)： 46/55頁(yè)
文件大?。?/td> 0K
描述： IC UART QUAD SOT314-2
標(biāo)準(zhǔn)包裝： 160
通道數(shù)： 4，QUART
FIFO's： 16 字節(jié)
電源電壓： 2.5V，3.3V，5V
帶自動(dòng)流量控制功能： 是
帶IrDA 編碼器/解碼器： 是
帶故障啟動(dòng)位檢測(cè)功能： 是
帶調(diào)制解調(diào)器控制功能： 是
帶CMOS： 是
安裝類型： 表面貼裝
封裝/外殼： 64-LQFP
供應(yīng)商設(shè)備封裝： 64-LQFP（10x10）
包裝： 托盤
其它名稱： 935270074151
SC16C554IB64-S
SC16C554IB64-S-ND
Philips Semiconductors
SC16C554/554D
Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
Product data
Rev. 05 — 10 May 2004
50 of 55
9397 750 13132
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
12. Soldering
12.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for ne
pitch SMDs. In these situations reow soldering is recommended. In these situations
reow soldering is recommended.
12.2 Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215 to 270
°C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 225
°C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness
≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume
≥ 350 mm3 so called
thick/large packages.
below 240
°C (SnPb process) or below 260 °C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
12.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
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參數(shù)描述
SC16C554IB80 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
SC16C554IB80,528 功能描述:UART 接口集成電路 Quad UART RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C554IB80,551 功能描述:UART 接口集成電路 16C 2.5V-5V 4CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C554IB80,557 功能描述:UART 接口集成電路 16C 2.5V-5V 4CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C650A 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Asynchronous Receiver/Transmitter (UART) with 32-byte FIFO and infrared (IrDA) encoder/decoder
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