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參數(shù)資料
| 型號： | SC16C554DIA68,512 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 48/55頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC UART QUAD W/FIFO 68-PLCC |
| 標(biāo)準(zhǔn)包裝： | 18 |
| 通道數(shù)： | 4，QUART |
| FIFO's： | 16 字節(jié) |
| 電源電壓： | 2.5V，3.3V，5V |
| 帶自動流量控制功能： | 是 |
| 帶IrDA 編碼器/解碼器： | 是 |
| 帶故障啟動位檢測功能： | 是 |
| 帶調(diào)制解調(diào)器控制功能： | 是 |
| 帶CMOS： | 是 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 68-LCC（J 形引線） |
| 供應(yīng)商設(shè)備封裝： | 68-PLCC |
| 包裝： | 管件 |
| 其它名稱： | 568-1110-5 935271490512 SC16C554DIA68 |
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Philips Semiconductors
SC16C554/554D
Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
Product data
Rev. 05 — 10 May 2004
52 of 55
9397 750 13132
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reow
soldering with peak temperature exceeding 217
°C ± 10 °C measured in the atmosphere of the reow
oven. The package body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex
foil by using a hot bar soldering process. The appropriate soldering prole can be provided on
request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SC16C554DIB64 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder |
| SC16C554DIB64,128 | 功能描述:UART 接口集成電路 16C 2.5V-5V 4CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C554DIB64,151 | 功能描述:UART 接口集成電路 16C 2.5V-5V 4CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C554DIB64,157 | 功能描述:UART 接口集成電路 16C 2.5V-5V 4CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C554IB64 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder |
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