參數(shù)資料
型號(hào): SBR3U30P1
廠商: Diodes Inc.
英文描述: 3.0A SBR Super Barrier Rectifier PowerDI TM 123
中文描述: 3.0A的SBR法超級(jí)障礙整流器PowerDI商標(biāo)123
文件頁(yè)數(shù): 1/4頁(yè)
文件大?。?/td> 281K
代理商: SBR3U30P1
SBR3U30P1
3.0A SBR
Super Barrier Rectifier
PowerDI123
Features
Mechanical Data
Case: PowerDI123
Case Material: Molded Plastic, “Green” Molding
compound. UL Flammability Classification Rating
94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Polarity Indicator: Cathode Band
Terminals: Matte Tin Finish annealed over
Copper leadframe. Solderable per MIL-STD-202,
Method 208
Marking Information: See Page 4
Ordering Information: See Page 4
Ultra Low Forward Voltage Drop
Superior Reverse Avalanche Capability
Patented Interlocking Clip Design for
High Surge Current Capacity
Patented Super Barrier Rectifier Technology
Soft, Fast Switching Capability
150oC Operating Junction Temperature
±16KV ESD Protection (HBM, 3B)
±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)
Lead Free Finish, RoHS Compliant (Note 1)
“Green” Molding Compound (No Br, Sb)
Qualified to AEC-Q 101 Standards for High Reliability
Maximum Ratings
@ T
A
= 25oC unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See Figure 1)
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Non-Repetitive Avalanche Energy
(T
J
= 25°C, I
AS
= 5A, L = 8.5 mH)
Repetitive Peak Avalanche Energy
(1μs, 25°C)
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
Operating and Storage Temperature Range (Note 5)
Notes:
1. RoHS revision 13.2.2003. High temperature solder exemption applied, see
EU Directive Annex Note 7.
2. Theoretical R
calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4
. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf
__________
SBR is a registered trademark of Diodes Incorporated.
PowerDI is a trademark of Diodes Incorporated.
Symbol
V
RRM
V
RWM
V
RM
V
R(RMS)
I
O
Value
Unit
30
V
21
3.0
V
A
I
FSM
75
A
E
AS
105
mJ
P
ARM
1100
W
R
JS
R
JA
5
178
123
°C/W
T
J
, T
STG
-65 to +150
oC
SBR3U30P1 Rev. 3 - 2
1 of 4
www.diodes.com
January 2007
Diodes Incorporated
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