
DS23022 Rev. 5 - 2
1 of 3
SB120-SB160
www.diodes.com
Diodes Incorporated
SB120 - SB160
1.0A SCHOTTKY BARRIER RECTIFIER
Features
A
A
B
C
D
DO-41 Plastic
Min
Dim
A
B
C
D
Max
25.40
4.06
5.21
0.71
0.864
2.00
2.72
All Dimensions in mm
Maximum Ratings and Electrical Characteristics
@ T
A
= 25 C unless otherwise specified
Schottky Barrier Chip
Guard Ring Die Construction for Transient Protection
Low Power Loss, High Efficiency
High Surge Capability
High Current Capability and Low Forward Voltage Drop
Surge Overload Rating to 40A Peak
For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Applications
Lead Free Finish, RoHS Compliant (Note 3)
Mechanical Data
Case: DO-41 Plastic
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Finish - Bright Tin. Plated Leads Solderable per
MIL-STD-202, Method 208
Polarity: Cathode Band
Mounting Position: Any
Ordering Information: See Last Page
Marking: Type Number
Weight: 0.3 grams (approximate)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
SB120
SB130
SB140
SB150
SB160
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
(Note 1)
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
(JEDEC Method)
Forward Voltage (Note 2)
20
30
40
50
60
V
14
21
28
35
42
V
(See Figure 1)
I
O
1.0
A
I
FSM
40
A
@ I
F
= 1.0A
V
FM
0.50
0.70
V
Peak Reverse Current
at Rated DC Blocking Voltage (Note 2)
@ T
A
= 25 C
@ T
A
= 100 C
I
RM
0.5
mA
10
5.0
Typical Thermal Resistance Junction to Lead (Note 1)
Typical Thermal Resistance Junction to Ambient
Operating Temperature Range
Storage Temperature Range
R
JL
R
JA
T
j
T
STG
15
50
C/W
C/W
-65 to +125
-65 to +150
C
-65 to +150
Notes: 1. Measured at ambient temperature at a distance of 9.5mm from the case.
2. Short duration test pulse used to minimize self-heating effect.
3. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.