參數(shù)資料
型號: SAK-XC2768X-136F128L
廠商: INFINEON TECHNOLOGIES AG
元件分類: 微控制器/微處理器
英文描述: 32-BIT, FLASH, 128 MHz, RISC MICROCONTROLLER, PQFP100
封裝: 0.50 MM PITCH, GREEN, PLASTIC, LQFP-100
文件頁數(shù): 117/131頁
文件大?。?/td> 1711K
代理商: SAK-XC2768X-136F128L
XC2768X
XC2000 Family Derivatives / Premium Line
Electrical Parameters
Preliminary
Data Sheet
86
V1.0, 2010-12
4.2.3
Power Consumption
The power consumed by the XC2768X depends on several factors such as supply
voltage, operating frequency, active circuits, and operating temperature. The power
consumption specified here consists of two components:
The switching current
I
S depends on the device activity
The leakage current
I
LK depends on the device temperature
To determine the actual power consumption, always both components, switching current
I
S and leakage current ILK must be added:
I
DDP = IS + ILK.
Note: The power consumption values are not subject to production test. They are
verified by design/characterization.
To determine the total power consumption for dimensioning the external power
supply, also the pad driver currents must be considered.
The given power consumption parameters and their values refer to specific operating
conditions:
Active mode:
Regular operation, i.e. peripherals are active, code execution out of Flash.
Stopover mode:
Crystal oscillator and PLL stopped, Flash switched off, clock in domain DMP_1
stopped.
Standby mode:
Voltage domain DMP_1 switched off completely, power supply control switched off.
Voltage domain DMP_M is supplied by the ultra low power embedded voltage
regulator (ULPEVR). The standard regulator (EVR_M) is switched off.
Note: The maximum values cover the complete specified operating range of all
manufactured devices.
The typical values refer to average devices under typical conditions, such as
nominal supply voltage, room temperature, application-oriented activity.
After a power reset, the decoupling capacitors for
V
DDIM and VDDI1 are charged with
the maximum possible current.
For additional information, please refer to Section 5.2, Thermal Considerations.
Note: Operating Conditions apply.
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