參數(shù)資料
型號: SAF7115HW
廠商: NXP SEMICONDUCTORS
元件分類: 顏色信號轉(zhuǎn)換
英文描述: Multistandard video decoder with super-adaptive comb filter, scaler and VBI data read-back via I2C-bus
中文描述: COLOR SIGNAL DECODER, PQFP100
封裝: 14 X 14 MM, 1 MM HEIGHT, PLASTIC, MS-026, SOT638, QFP-100
文件頁數(shù): 26/35頁
文件大?。?/td> 217K
代理商: SAF7115HW
SAF7115_1
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 15 October 2008
26 of 35
NXP Semiconductors
SAF7115
Multistandard video decoder
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 9
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 11
and
12
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 9
.
Table 11.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
350
220
220
< 2.5
2.5
Table 12.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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