參數(shù)資料
型號(hào)： SAA5561
廠商： NXP Semiconductors N.V.
英文描述： Enhanced TV microcontrollers with On-Screen Display OSD
中文描述： 與微控制器在強(qiáng)化電視屏幕顯示OSD
文件頁數(shù)： 96/100頁
文件大?。?/td> 371K
代理商： SAA5561
2000 Feb 23
96
Philips Semiconductors
Preliminary specification
Enhanced TV microcontrollers with
On-Screen Display (OSD)
SAA55xx
28 SOLDERING
28.1
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering.Amorein-depth account ofsoldering ICscanbe
found in our “Data Handbook IC26; Integrated Circuit
Packages”(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
28.2
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
Thetotalcontacttimeofsuccessivesolderwavesmustnot
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
28.3
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
28.4
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable
(1)
相關(guān)PDF資料
PDF描述
SAA5562 Enhanced TV microcontrollers with On-Screen Display OSD
SAA5562PS Enhanced TV microcontrollers with On-Screen Display OSD
SAA5563 Enhanced TV microcontrollers with On-Screen Display OSD
SAA5563PS Enhanced TV microcontrollers with On-Screen Display OSD
SAA5564 Enhanced TV microcontrollers with On-Screen Display OSD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SAA5561PS 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Enhanced TV microcontrollers with On-Screen Display OSD
SAA5562 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Enhanced TV microcontrollers with On-Screen Display OSD
SAA5562PS 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Enhanced TV microcontrollers with On-Screen Display OSD
SAA5563 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Enhanced TV microcontrollers with On-Screen Display OSD
SAA5563PS 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Enhanced TV microcontrollers with On-Screen Display OSD
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