參數(shù)資料
型號(hào)： SAA5265
廠商： NXP Semiconductors N.V.
英文描述： 10 and 1 page intelligent teletext decoders
中文描述： 10和1頁(yè)智能圖文電視解碼器
文件頁(yè)數(shù)： 15/24頁(yè)
文件大小： 97K
代理商： SAA5265
2000 Jan 27
15
Philips Semiconductors
Preliminary specification
10 and 1 page intelligent teletext decoders
SAA5264; SAA5265
EMC GUIDELINES
Optimization of circuit return paths and minimization of
common mode emission will be assisted by using a double
sided Printed Circuit Board (PCB) with low inductance
ground plane.
On a single-sided PCB a local ground plane under the
whole IC should be present as shown in Fig.3. This should
have the widest possible connection between the PCB
ground and bulk electrolytic decoupling capacitor.
Preferably, the PCB local ground plane connection should
not be connected to other grounds on route to the PCB
ground. Do not use wire links. Wire links cause ground
inductance which increases ground bounce.
The supply pins can be decoupled at the ground pin plane
below the IC. This is easily achieved by using surface
mount capacitors, which, at high frequency, are more
effective than components with leads.
Using a device socket would increase the area and
therefore increase the inductance of the external bypass
loop.
To provide a high-impedance to any high frequency
signals on the V
DD
supplies to the IC, a ferrite bead or
inductor can be connected in series with the supply line
close to the decoupling capacitor. To prevent signal
radiation, pull-up resistors of signal outputs should not be
connected to the V
DD
supply on the IC side of the ferrite
bead or inductor.
OSCGND should only be connected to the crystal load
capacitors and not to any other ground connection.
Distances to physical connections of associated active
devices should be as short as possible.
PCB output tracks should have close proximity, mutually
coupled, ground return paths.
handbook, full pagewidth
electrolytic decoupling capacitor (2
μ
F)
ferrite beads
SM decoupling capacitors (10 to 100 nF)
under-IC GND plane
IC
MBK979
VSSC
VSSA
V
V
V
V
GND
+
3.3 V
other
GND
connections
under-IC GND plane
GND connection
note: no wire links
Fig.3 Power supply connections for EMC.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SAA5265PS 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:10 and 1 page intelligent teletext decoders
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SAA5281 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Integrated Video input processor and Teletext decoder IVT1.8
SAA5281GP 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Integrated Video input processor and Teletext decoder IVT1.8
SAA5281P 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Integrated Video input processor and Teletext decoder IVT1.8
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