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參數(shù)資料
| 型號： | SAA5263PS |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 圖文 |
| 英文描述： | 10-page intelligent teletext decoders |
| 中文描述： | TELETEXT DECODER, PDIP52 |
| 封裝： | 0.600 INCH, SHRINK, PLASTIC, SOT-247-1, DIP-52 |
| 文件頁數(shù)： | 23/28頁 |
| 文件大小： | 350K |
| 代理商： | SAA5263PS |
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1998 Apr 22
23
Philips Semiconductors
Product specification
10-page intelligent teletext decoders
SAA5261; SAA5262; SAA5263
EMC GUIDELINES
Optimization of circuit return paths and minimisation of
common mode noise will be assisted by using a
double-sided PCB with a low inductance ground plane.
On a single-sided PCB a local ground plane under the
whole IC should be present, as shown in Fig.16. This
should be connected by the widest possible connection
back to the PCB ground connection and bulk electrolytic
decoupling capacitor. It should preferably not connect to
other grounds on the way and no wire links should be
present in this connection. The use of wire links increases
ground bounce by introducing inductance into the ground.
The supply pins can be decoupled at the pin to the ground
plane under the IC. This is easily accomplished using
surface mount capacitors, which are more effective than
leaded components at high frequency. Using a device
socket will unfortunately add to the area and inductance of
the external bypass loop.
A ferrite bead or inductor with resistive characteristics at
high frequency may be utilized in the supply line close to
the decoupling capacitor to provide a high impedance.
To prevent pollution by conduction onto signal lines (which
may then radiate) signals connected to the +5 V supply via
a pull up resistor should not be connected to the IC side of
the ferrite component.
OSCGND should be connected only to the crystal load
capacitors and not the local or circuit ground.
Keep physical connection distances to associated active
devices short.
Route output traces with close proximity mutually coupled
ground return paths.
Fig.16 Power supply and ground connections for SOT247-1.
handbook, full pagewidth
electrolytic decoupling capacitor (2.2
μ
F)
ferrite components
SM decoupling capacitors (22 to 100 nF)
VDDA
under-IC GND plane
IC(SAA5290)
MGL414
VSSD
VSSA
VDDD(M)
VDDD(T)
GND
+
5 V
other
GND
connections
under-IC GND plane
GND connection
note: no wire links
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