
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
75
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
NE5534AD
ACTIVE
8
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR
NE5534ADR
ACTIVE
SOIC
D
8
2500
CU NIPDAU
Level-2-250C-1 YEAR
NE5534AJG
NE5534AP
OBSOLETE
ACTIVE
CDIP
PDIP
JG
P
8
8
Call TI
CU NIPDAU
Call TI
Level-NC-NC-NC
50
NE5534D
ACTIVE
SOIC
D
8
75
CU NIPDAU
Level-2-250C-1 YEAR
NE5534DR
ACTIVE
SOIC
D
8
2500
CU NIPDAU
Level-2-250C-1 YEAR
NE5534IP
NE5534P
OBSOLETE
ACTIVE
PDIP
PDIP
P
P
8
8
Call TI
CU NIPDAU
Call TI
Level-NC-NC-NC
50
NE5534PSR
ACTIVE
SO
PS
8
2000
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
SA5534AD
ACTIVE
SOIC
D
8
75
CU NIPDAU
SA5534ADR
ACTIVE
SOIC
D
8
2500
CU NIPDAU
SA5534AP
ACTIVE
PDIP
P
8
50
CU NIPDAU
SA5534D
ACTIVE
SOIC
D
8
75
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
SA5534DR
ACTIVE
SOIC
D
8
2500
CU NIPDAU
SA5534P
ACTIVE
PDIP
P
8
50
CU NIPDAU
SA5534PS
ACTIVE
SO
PS
8
80
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SA5534PSR
ACTIVE
SO
PS
8
2000
CU NIPDAU
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
Not yet available Lead (Pb-Free).
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.