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參數(shù)資料
| 型號： | SA532FE |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 運動控制電子 |
| 英文描述： | Low power dual operational amplifi |
| 中文描述： | DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, CDIP8 |
| 封裝： | CERAMIC, DIP-8 |
| 文件頁數(shù)： | 3/12頁 |
| 文件大?。?/td> | 128K |
| 代理商： | SA532FE |
Philips Semiconductors
Product data
NE/SA/SE532/
LM258/358/A/2904
Low power dual operational amplifiers
2002 Jul 12
3
ORDERING INFORMATION
DESCRIPTION
TEMPERATURE RANGE
0
°
C to +70
°
C
0
°
C to +70
°
C
–40
°
C to +85
°
C
–40
°
C to +125
°
C
–40
°
C to +125
°
C
–40
°
C to +125
°
C
–25
°
C to +125
°
C
–25
°
C to +125
°
C
0
°
C to +70
°
C
0
°
C to +70
°
C
0
°
C to +70
°
C
0
°
C to +70
°
C
0
°
C to +70
°
C
–55
°
C to +125
°
C
ORDER CODE
DWG #
8-Pin Plastic Small Outline (SO) Package
NE532D
SOT96-1
8-Pin Plastic Dual In-Line Package (DIP)
NE532N
SOT97-1
8-Pin Plastic Small Outline (SO) Package
SA532D
SOT96-1
8-Pin Plastic Small Outline (SO) Package
LM2904D
SOT96-1
8-Pin Plastic Thin Shrink Small Outline Package (TSSOP)
LM2904DP
SOT505-1
8-Pin Plastic Dual In-Line Package (DIP)
LM2904N
SOT97-1
8-Pin Plastic Small Outline (SO) Package
LM258D
SOT96-1
8-Pin Plastic Dual In-Line Package (DIP)
LM258N
SOT97-1
8-Pin Plastic Small Outline (SO) Package
LM358D
SOT96-1
8-Pin Plastic Thin Shrink Small Outline Package (TSSOP)
LM358DP
SOT505-1
8-Pin Plastic Dual In-Line Package (DIP)
LM358N
SOT97-1
8-Pin Plastic Small Outline (SO) Package
LM358AD
SOT96-1
8-Pin Plastic Dual In-Line Package (DIP)
LM358AN
SOT97-1
8-Pin Plastic Dual In-Line Package (DIP)
SE532N
SOT97-1
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
RATING
32 or
±
16
32
UNIT
V
S
Supply voltage, V+
V
DC
V
DC
V
DC
Differential input voltage
V
IN
Input voltage
–0.3 to +32
Maximum power dissipation
T
amb
= 25
°
C (Still air)
1
N package
D package
DP package
Output short-circuit to GND
2
V+ < 15 V
DC
and T
amb
= 25
°
C
Operating ambient temperature range
NE532/LM358/LM358A
LM258
LM2904
SA532
SE532
Storage temperature range
P
D
1160
780
714
mW
mW
mW
Continuous
0 to +70
–25 to +85
–40 to +125
–40 to +85
–55 to +125
–65 to +150
°
C
°
C
°
C
°
C
°
C
°
C
°
C
T
amb
T
stg
T
sld
NOTE:
1. Derate above 25
°
C, at the following rates:
N package at 9.3 mW/
°
C
D package at 6.2 mW/
°
C
DP package at 5.72 mW/
°
C
2. Short-circuits from the output to V+ can cause excessive heating and eventual destruction. The maximum output current is approximately
40 mA independent of the magnitude of V+. At values of supply voltage in excess of +15 V
DC
, continuous short-circuits can exceed the
power dissipation ratings and cause eventual destruction.
Lead soldering temperature (10 sec max)
230
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