參數(shù)資料
型號: S9S08SC4E0CTGR
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: MICROCONTROLLER, PDSO16
封裝: 0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16
文件頁數(shù): 30/31頁
文件大小: 765K
代理商: S9S08SC4E0CTGR
Chapter 3 Electrical Characteristics
MC9S08SC4 MCU Series Data Sheet, Rev. 4
8
Freescale Semiconductor
3.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and
it is user-determined rather than being controlled by the MCU design. To take PI/O into account in power calculations, determine
the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small.
Table 3-2. Absolute Maximum Ratings
Rating
Symbol
Value
Unit
Supply voltage
VDD
–0.3 to +5.8
V
Maximum current into VDD
IDD
120
mA
Digital input voltage
VIn
–0.3 to VDD +0.3
V
Instantaneous maximum current
Single pin limit (applies to all port pins)1, 2, 3
1
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp
voltages, then use the larger of the two resistance values.
2 All functional non-supply pins are internally clamped to V
SS and VDD.
3 Power supply must maintain regulation within operating V
DD range during instantaneous and
operating maximum current conditions. If positive injection current (VIn > VDD) is greater than
IDD, the injection current may flow out of VDD and could result in external power supply going
out of regulation. Ensure external VDD load will shunt current greater than maximum injection
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low (which would reduce overall power
consumption).
ID
± 25
mA
Storage temperature range
Tstg
–55 to 150
°C
Table 3-3. Thermal Characteristics
Num
C
Rating
Symbol
Value
Unit
1
Operating temperature range (packaged)
TL to TH
°C
CTA
–40 to 85
V
–40 to 105
M
–40 to 125
Maximum junction temperature
°C
2D
C
TJM
95
V
115
M
135
Thermal resistance 1,2
Single-layer board
3
D
16-pin TSSOP
θ
JA
130
°C/W
Thermal resistance1,2
Four-layer board
4
D
16-pin TSSOP
θ
JA
87
°C/W
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