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參數(shù)資料
| 型號： | S9S08MP16E2MLF |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 2/36頁 |
| 文件大?。?/td> | 0K |
| 描述： | MCU 16K FLASH 20MHZ AUTO 48-LQFP |
| 標(biāo)準(zhǔn)包裝： | 1,250 |
| 系列： | S08 |
| 核心處理器： | S08 |
| 芯體尺寸： | 8-位 |
| 速度： | 40MHz |
| 連通性： | I²C，LIN，SCI，SPI |
| 外圍設(shè)備： | LVD，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 40 |
| 程序存儲器容量： | 16KB（16K x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 1K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 2.7 V ~ 5.5 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 13x12b，D/A 3x5b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 125°C |
| 封裝/外殼： | 48-LQFP |
| 包裝： | 托盤 |
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MC9S08MP16 Series Data Sheet, Rev. 2
Electrical Characteristics
Freescale Semiconductor
10
2.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and
it is user-determined rather than being controlled by the MCU design. To take PI/O into account in power calculations, determine
the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in C can be obtained from:
TJ = TA + (PD JA)
Eqn. 1
where:
TA = Ambient temperature, C
JA = Package thermal resistance, junction-to-ambient, C/W
PD = Pint PI/O
Pint = IDD VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O Pint and can be neglected. An approximate relationship between PD and TJ (if PI/O is neglected)
is:
PD = K (TJ + 273C)
Eqn. 2
Solving Equation 1 and Equation 2 for K gives:
K = PD (TA + 273C) + JA (PD)
2
Eqn. 3
Table 4. Thermal Characteristics
Num
C
Rating
Symbol
Consumer &
Industrial
Automotive
Unit
1
—
Operating temperature range (packaged)
TA
–40 to 105
–40 to 125
C
2
D
Maximum junction temperature
TJ
115
135
C
3
D
Thermal resistance 1,2
single-layer board
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2 Junction-to-ambient natural convection
48-pin LQFP
JA
80
C/W
32-pin LQFP
85
—
28-pin SOIC
71
—
4
D
Thermal resistance 1,2
four-layer board
48-pin LQFP
JA
56
C/W
32-pin LQFP
57
—
28-pin SOIC
48
—
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S9S08MP16E2MLFR | 制造商:Freescale Semiconductor 功能描述: |
| S9S08MP16E2MWL | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:8-Bit HCS08 Central Processor Unit (CPU) |
| S9S08MP16E2VLC | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:8-Bit HCS08 Central Processor Unit (CPU) |
| S9S08MP16E2VLF | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:8-Bit HCS08 Central Processor Unit (CPU) |
| S9S08MP16E2VWL | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:8-Bit HCS08 Central Processor Unit (CPU) |
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