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參數(shù)資料
| 型號(hào)： | S75WS256NDGBAWUK3 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁(yè)數(shù)： | 10/15頁(yè) |
| 文件大?。?/td> | 235K |
| 代理商： | S75WS256NDGBAWUK3 |
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S75WS-N Based MCPs
S75WS-N_02_A2 October 6, 2005
P r e l i m i n a r y
5
Connection Diagrams/Physical Dimensions
This section contains the I/O designations and package specifications for the S75WS.
5.1
Special Handling Instructions for FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning meth-
ods. The package and/or data integrity may be compromised if the package body is exposed to
temperatures above 150°C for prolonged periods of time.
5.2
Connection Diagram – NOR Flash & 1.8 V RAM Type 4 Based Pinout, 9 x 12 mm
DNU
DNU
M10
Legend:
DNU
DNU
B2
ADV#
VSS
B3
B4
CLK
F-VCC
B6
C5
D5
RFU
B7
RFU
B8
RFU
B9
RFU
B5
F1-WP#
C2
A7
C3
R-LB#
C4
WE#
C6
A8
C7
A11
C8
F2-CE#
C9
F-ACC
A3
D2
A6
D3
R-UB#
D4
RFU
D6
A19
D7
A12
D8
A15
D9
F-RST#
A2
E2
A5
E3
A18
E4
A20
E6
A9
E7
A13
E8
A21
E9
RDY
E5
A1
F2
A4
F3
A17
F4
A23
A10
F7
A14
F8
A22
F9
RFU
F5
A0
G2
VSS
G3
DQ1
G4
RFU
G6
DQ6
G7
RFU
G8
A16
G9
RFU
G5
F1-CE#
H2
OE#
H3
DQ9
H4
DQ4
H6
DQ13
H7
DQ15
H8
R-MRS#
H9
DQ3
H5
R-CE1#
J2
DQ0
J3
DQ10
J4
R-VCC
J6
DQ12
J7
DQ7
J8
VSS
J9
F-VCC
J5
RFU
K2
DQ8
K3
DQ2
K4
RFU
K6
DQ5
K7
DQ14
K8
FD-WP#
K9
DQ11
K5
RFU
L2
RFU
L3
VSS
L4
F3-CE#
L6
RFU
L7
F-VCCQ
L8
DNU
L9
F-VCC
L5
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
RFU
(Reserved for
Future Use)
Data Flash
Shared Only
Flash 2
Data Only
Flash 3
Data Only
Flash 1
Code Only
RAM Only
All Shared
All Flash
Shared Only
Do Not Use
A1
A10
F6
M1
相關(guān)PDF資料 |
PDF描述 |
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| S75WS256NDGBFWLK0 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBFWLK2 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBFWLK3 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBFWNK0 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBFWNK2 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S75WS256NDGBFWLH0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBFWLH2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBFWLH3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBFWLJ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBFWLJ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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