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參數(shù)資料
| 型號(hào)： | S75WS256NDGBAWNH0 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁(yè)數(shù)： | 1/10頁(yè) |
| 文件大小： | 123K |
| 代理商： | S75WS256NDGBAWNH0 |
Publication Number
S73WS-P_00
Revision
A
Amendment
0
Issue Date
March 16, 2006
S73WS-P based MCP Products
1.8 Volt-only x16 Simultaneous Read/Write,
Burst Mode Flash
Mobile SDRAM on Shared Bus
S73WS-P based MCP Products Cover Sheet
Data Sheet
(Advance Information)
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
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| S75WS256NDGBAWNH2 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBAWNH3 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBAWNJ0 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBFWSJ3 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBFWUH0 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S75WS256NDGBAWNH2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBAWNH3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBAWNJ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBAWNJ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBAWNJ3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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