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參數(shù)資料
| 型號： | S75WS256NDFBFWSJ0 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁數(shù)： | 12/15頁 |
| 文件大小： | 235K |
| 代理商： | S75WS256NDFBFWSJ0 |
10
S75WS-N Based MCPs
S75WS-N_02_A2 October 6, 2005
P r e l i m i n a r y
5.4
Physical Dimensions – FEA084 – Fine Pitch Ball Grid Array 9 x 12 mm
3423 \ 16-038.21a
PACKAGE
FEA 084
JEDEC
N/A
D x E
12.00 mm x 9.00 mm
PACKAGE
NOTE
SYMBOL
MIN
NOM
MAX
A
---
---
1.40
PROFILE
A1
0.10
---
---
BALL HEIGHT
A2
1.11
---
1.26
BODY THICKNESS
D
12.00 BSC.
BODY SIZE
E
9.00 BSC.
BODY SIZE
D1
8.80 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
12
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
84
BALL COUNT
b
0.35
0.40
0.45
BALL DIAMETER
eE
0.80 BSC.
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
A2,A3,A4,A5,A6,A7,A8,A9
B1,B10,C1,C10,D1,D10
E1,E10,F1,F10,G1,G10
H1,H10,J1,J10,K1,K10,L1,L10
M2,M3,M4,M5,M6,M7,M8,M9
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
C
0.08
0.20
C
A
E
B
C
0.15
(2X)
C
D
C
0.15
(2X)
INDEX MARK
10
6
b
M
M
TOP VIEW
SIDE VIEW
CORNER
84X
A1
A2
A
PIN A1
M L
E1
7
SE
A
D1
eD
D
C
E
F
G
H
J
K
10
9
8
7
6
4
3
2
1
eE
5
B
PIN A1
CORNER
7
SD
BOTTOM VIEW
0.15
0.08
C A B
C
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| S75WS256NDFBFWSK0 | Stacked Multi-Chip Product (MCP) |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| S75WS256NDFBFWSJ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBFWSJ3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBFWSK0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBFWSK2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBFWSK3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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