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參數(shù)資料
| 型號(hào)： | S75WS256NDFBAWUJ2 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁(yè)數(shù)： | 5/10頁(yè) |
| 文件大?。?/td> | 123K |
| 代理商： | S75WS256NDFBAWUJ2 |
S73WS-P_00_A0 March 16, 2006
S73WS-P based MCP Products
3
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
3.
Connection Diagrams
3.1
512 Mb NOR Flash with 128 Mb SDR-DRAM
Note:
DDR-only signals are RFUs in the case of the SDR DRAM-based solutions.
3.1.0.1
Special Handling Instructions For FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150×C for prolonged periods of time.
3
2
9
10
5
4
7
6
8
1
RFU
D-CLK
D-VSS
D-CE#
D-VSS
RFU
RFU
D-VCC
RFU
D-CKE
B
D
E
F
G
H
J
K
L
M
N
P
A
C
RFU
D-WE#
RFU
D-CAS#
D-VSSQ
RFU
RFU
D-VCCQ
RFU
D-RAS#
VSS
F-AVD#
RFU
RFU
RFU
F-CLK
RFU
F-VCC
RFU
RFU
A7
F-WP#
RFU
RFU
F-ACC
D-DM0
A8
WE#
A11
RFU
A6
A3
A15
D-VCCQ
F-RST#
D-DM1
A19
DNU
A12
D-VCCQ
A5
A2
A21
D-VSSQ
F-RDY
A18
A9
A20
A13
D-VSSQ
A4
A1
A22
RFU
A17
A10
A23
A14
RFU
VSS
A0
A16
RFU
DQ1
DQ6
A24
RFU
OE#
F-CE#
DNU
RFU
DQ3
DQ9
DQ13
DQ4
DQ15
RFU
DQ0
DNU
VSS
RFU
F-VCC
DQ10
DQ12
RFU
DQ7
RFU
DQ8
RFU
RFU
RFU
DQ11
DQ2
DQ5
RFU
DQ14
RFU
RFU
RFU
DNU
RFU
F-VCC
VSS
DNU
RFU
F-VCCQ
RFU
RFU
D-BA0
D-BA1
RFU
D-VSSQ
RFU
RFU
D-VCCQ
RFU
RFU
RFU
D-VSS
DNU
RFU
D-VSS
RFU
RFU
D-VCC
RFU
RFU
Legend
Shared
Do Not Use
NOR Flash Only
DRAM Only
Reserved for Future Use
137-ball Fine-Pitch Ball Grid Array
(Top View, Balls Facing Down)
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| S75WS256NDFBAWUJ3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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| S75WS256NDFBAWUK3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBFWLH0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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