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Publication Number
S75WS-N_02
Revision
A
Amendment
2
Issue Date
October 6, 2005
General Description
The S75WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists
of the following items:
One or more S29WS-N code Flash
RAM Type 4
One or more S29WS-N data Flash, or one or more S30MS-P ORNAND Flash
The products covered by this document are listed in the table below:
Distinctive Characteristics
MCP Features
Pow er supply voltage of 1.7 V to 1.95 V
High Performance
— 54 MHz, 66 Mhz, 80 MHz
Packages
— 9 x 12 mm 84 ball FBGA
— 11 x 13 mm 115 ball FBGA
Operating Temperature
— Wireless, –25°C to + 85°C
S75WS-N Based MCPs
Stacked Multi-Chip Product (MCP)
256 Megabit (16M x 16-bit) CMOS 1.8 Volt-only
Simultaneous Read/Write, Burst-mode Flash Memory with
128 Mb (8M x 16-Bit) RAM Type 4 and
512 Mb (32M x 16-bit) Data Flash or 1Gb ORNAND Flash
Data Sheet
PRELIMINARY
Device
Code Flash
Density
RAM
Density
NOR Data Flash
Density
ORNAND Data Flash
Density
256 Mb
128 Mb
256 Mb
512 Mb
1024 Mb
S75WS256NDF
S75WS256NEG
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S75WS256NDFBAWSK3 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWUK0 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWUK2 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWUK3 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBFWUK0 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S75WS256NDFBAWSK3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWUH0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWUH2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWUH3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWUJ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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