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參數(shù)資料
| 型號(hào)： | S75PL256NBFJFWGZ3 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁(yè)數(shù)： | 1/8頁(yè) |
| 文件大?。?/td> | 177K |
| 代理商： | S75PL256NBFJFWGZ3 |
Publication Number
S75PL-N_00
Revision
01E
Issue Date
April 21, 2006
S75PL-N MirrorBit
ORNAND
MCPs
Stacked Multi-Chip Product (MCP)
S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write,
Page-mode Flash Memory (NOR Interface)
S30ML-P: ORNAND Flash (NAND Interface)
3V pSRAM
S75PL-N MirrorBit
ORNAND
MCPs Cover Sheet
Data Sheet
(Advance Information)
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S75PL256NBGJAWGZ0 | Stacked Multi-Chip Product (MCP) |
| S75PL256NBGJAWGZ2 | Stacked Multi-Chip Product (MCP) |
| S75PL256NBGJAWGZ3 | Stacked Multi-Chip Product (MCP) |
| S75PL256NBGJFWGZ0 | Stacked Multi-Chip Product (MCP) |
| S75PL256NBGJFWGZ2 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S75PL256NBGJAWGZ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL256NBGJAWGZ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL256NBGJAWGZ3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL256NBGJFWGZ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL256NBGJFWGZ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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