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參數資料
| 型號： | S75PL127NDFJAWGZ2 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產品（MCP） |
| 文件頁數： | 4/8頁 |
| 文件大?。?/td> | 177K |
| 代理商： | S75PL127NDFJAWGZ2 |
2
S75PL-N MirrorBit
ORNAND
MCPs
S75PL-N_00
_
01E April 21, 2006
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
1.
Ordering Information
The ordering part number is formed by a valid combination of the following:
S75PL
127
N
B
F
JF
W
GZ
0
PACKING TYPE
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER
Refer to the Valid Combinations table below
TEMPERATURE RANGE
W = Wireless (–25°C to +85°C)
PACKAGE TYPE AND MATERIAL
JA = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free Compliant package
JF = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free package
ORNAND DATA DENSITY
F = S30ML512P
G = S30ML01GP
pSRAM DENSITY
B = 32 Mb pSRAM
C = 64 Mb pSRAM
D = 128 Mb pSRAM
PROCESS TECHNOLOGY
N = 110 nm MirrorBit Technology
FLASH DENSITY
256 = 256 Mb
127 = 128 Mb (Single CE#)
DEVICE FAMILY
S75PL = 3.0 Volt-only Simultaneous Read/Write, Page Mode Flash Memory with Data storage
ORNAND and pSRAM
相關PDF資料 |
PDF描述 |
|---|---|
| S75PL127NDFJAWGZ3 | Stacked Multi-Chip Product (MCP) |
| S75PL127NDFJFWGZ0 | Stacked Multi-Chip Product (MCP) |
| S75PL127NDFJFWGZ2 | Stacked Multi-Chip Product (MCP) |
| S75PL127NDFJFWGZ3 | Stacked Multi-Chip Product (MCP) |
| S75PL127NDGJAWGZ0 | Stacked Multi-Chip Product (MCP) |
相關代理商/技術參數 |
參數描述 |
|---|---|
| S75PL127NDFJAWGZ3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL127NDFJFWGZ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL127NDFJFWGZ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL127NDFJFWGZ3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL127NDGJAWGZ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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