采購需求
(若只采購一條型號,填寫一行即可)| *型號 | *數(shù)量 | 廠商 | 批號 | 封裝 |
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| 型號: | S73WS256NEEBAWA70 |
| 廠商: | Spansion Inc. |
| 英文描述: | Stacked Multi-Chip Product (MCP) |
| 中文描述: | 堆疊式多芯片產(chǎn)品(MCP) |
| 文件頁數(shù): | 53/251頁 |
| 文件大?。?/td> | 3747K |
| 代理商: | S73WS256NEEBAWA70 |

相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S73WS256NEEBAWA72 | Stacked Multi-Chip Product (MCP) |
| S73WS256NEEBAWA73 | Stacked Multi-Chip Product (MCP) |
| S73WS256NEEBAWAB0 | Stacked Multi-Chip Product (MCP) |
| S73WS256NEEBAWAB2 | Stacked Multi-Chip Product (MCP) |
| S73WS256NEEBAWAB3 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S73WS256NEEBAWA72 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S73WS256NEEBAWA73 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S73WS256NEEBAWAB0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S73WS256NEEBAWAB2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S73WS256NEEBAWAB3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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