| 型號: | S73WS256ND0BFWA73 |
| 廠商: | SPANSION LLC |
| 元件分類: | 存儲(chǔ)器 |
| 英文描述: | Stacked Multi-Chip Product (MCP) |
| 中文描述: | SPECIALTY MEMORY CIRCUIT, PBGA137 |
| 封裝: | 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137 |
| 文件頁數(shù): | 203/251頁 |
| 文件大?。?/td> | 3747K |
| 代理商: | S73WS256ND0BFWA73 |

相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S73WS256ND0BFWAB0 | Stacked Multi-Chip Product (MCP) |
| S73WS256ND0BFWAB2 | Stacked Multi-Chip Product (MCP) |
| S73WS256ND0BFWAB3 | Stacked Multi-Chip Product (MCP) |
| S73WS256ND0BFWT70 | Stacked Multi-Chip Product (MCP) |
| S73WS256ND0BFWT72 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S73WS256ND0BFWAB0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S73WS256ND0BFWAB2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S73WS256ND0BFWAB3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S73WS256ND0BFWT70 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S73WS256ND0BFWT72 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |