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參數(shù)資料
| 型號(hào)： | S73WS-P |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁(yè)數(shù)： | 1/10頁(yè) |
| 文件大小： | 123K |
| 代理商： | S73WS-P |
Publication Number
S73WS-P_00
Revision
A
Amendment
0
Issue Date
March 16, 2006
S73WS-P based MCP Products
1.8 Volt-only x16 Simultaneous Read/Write,
Burst Mode Flash
Mobile SDRAM on Shared Bus
S73WS-P based MCP Products Cover Sheet
Data Sheet
(Advance Information)
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| S-73X | 制造商:Triad Magnetics 功能描述: |
| S74_MPSL51 WAF | 制造商:Fairchild Semiconductor Corporation 功能描述: |
| S-740 | 制造商:ARW 功能描述: |
| S741 | 制造商:Hubbell Premise Wiring 功能描述: |
| S-741 | 制造商:ARW 功能描述: |
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