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參數(shù)資料
| 型號： | S72WS512NFGBFW4Y0 |
| 廠商： | SPANSION LLC |
| 元件分類： | 存儲器 |
| 英文描述： | Based MCP/PoP Products |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA137 |
| 封裝： | 11 X 13 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137 |
| 文件頁數(shù)： | 25/30頁 |
| 文件大小： | 810K |
| 代理商： | S72WS512NFGBFW4Y0 |
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June 1, 2006 S72WS-N_00_A8
S72WS-N Based MCP/PoP Products
23
A d v a n c e I n f o r m a t i o n
5.4
BWA160—160-ball Fine-Pitch Ball Grid Array (FBGA) 15 x 15 mm Package
3518 \ 16-038.46 \ 02.23.06
PACKAGE
BWA 160
JEDEC
N/A
D x E
15.00 mm x 15.00 mm
PACKAGE
NOTE
SYMBOL
MIN
NOM
MAX
A
---
---
1.25
PROFILE
A1
0.35
---
---
BALL HEIGHT
A2
0.74
---
0.84
BODY THICKNESS
D
15.00 BSC.
BODY SIZE
E
15.00 BSC.
BODY SIZE
D1
13.65 BSC.
MATRIX FOOTPRINT
E1
13.65 BSC.
MATRIX FOOTPRINT
MD
22
MATRIX SIZE D DIRECTION
ME
22
MATRIX SIZE E DIRECTION
n
160
BALL COUNT
N
160
MAXIMUM NUMBER OF BALLS
R
2
NUMBER OF LAND PARAMETERS
b
0.40
0.45
0.50
BALL DIAMETER
eE
0.65 BSC.
BALL PITCH
eD
0.65 BSC.
BALL PITCH
SD SE
0.325 BSC.
SOLDER BALL PLACEMENT
C3~C20,D3~D20,E3~E20,F3~F20
R3~R20,T3~T20,U3~U20,V3~V20
W3~W20,Y3~Y20
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
Y
AA
AB
W
19
21 20
22
C
C
0.20
0.10
C
6
b
SIDE VIEW
A2
A
160X
A1
0.15 M C A B
0.08 M C
A
B
C
7
D
E
F
G
H
J
K
SE
CORNER
E1
M
N
P
R
L
T
U
PIN A1
D1
7
eE
SD
eD
V
1
4
5
2
3
6
7
8
9
10
11
12
13
15 14
BOTTOM VIEW
17
18
16
A
D
E
INDEX MARK
9
CORNER
PIN A1
C
B
0.10
(2X)
TOP VIEW
C
0.10
(2X)
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相關代理商/技術參數(shù) |
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|---|---|
| S72WS512NFGBFW4Y2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Based MCP/PoP Products |
| S72WS512NFGBFW4Y3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Based MCP/PoP Products |
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| S72WS512NFGKFW4Y3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Based MCP/PoP Products |
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