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參數(shù)資料
| 型號： | S72WS512NFG-L6 |
| 廠商： | Spansion Inc. |
| 英文描述： | Based MCP/PoP Products |
| 中文描述： | 基于MCP的/流行產品 |
| 文件頁數(shù)： | 18/30頁 |
| 文件大?。?/td> | 810K |
| 代理商： | S72WS512NFG-L6 |
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16
S72WS-N Based MCP/PoP Products
S72WS-N_00_A8 June 1, 2006
A d v a n c e I n f o r m a t i o n
4 Ordering Information
The order number is formed by a valid combinations of the following:
S72WS
512
N
EG
BA
W
4
Y
0
PACKING TYPE
0
= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
MODEL NUMBER
Refer to the Valid Combinations Tables
PACKAGE MODIFIER
Refer to the Valid Combinations Tables
TEMPERATURE RANGE
W
= Wireless (-25
°
C to +85
°
C)
PACKAGE TYPE
BA
= Very-thin Fine-pitch BGA Lead (Pb)-free compliant package
BF
= Very-thin Fine-pitch BGA Lead (Pb)-free package
KF
= Fine-pitch Package-on-Package (PoP) Lead (Pb)-free
SDRAM & DATA FLASH DENSITY
EE
= 256 Mb SDRAM, 256 Mb Data Flash
DE
= 128 Mb SDRAM, 256 Mb Data Flash
D0
= 128 Mb SDRAM, No Data Flash
FG
= 512 Mb SDRAM, 1024 Mb ORNAND Flash
EG
= 256 Mb SDRAM, 1024 Mb ORNAND Flash
EF
= 256Mb SDRAM, 512Mb NAND Flash
FF
= 512Mb SDRAM, 512Mb NAND Flash
PROCESS TECHNOLOGY
N
= 110 nm, MirrorBit
TM
Technology
CODE FLASH DENSITY
256
= 256Mb
512
= 512Mb
PRODUCT FAMILY
S72WS Multi-chip Product (MCP)
1.8-volt Simultaneous Read/Write, Burst Mode Flash Memory and Mobile
SDRAM on Split Bus
相關PDF資料 |
PDF描述 |
|---|---|
| S72WS512NFG-L7 | Based MCP/PoP Products |
| S72WS512NFG-LW | Based MCP/PoP Products |
| S72WS512NFG-LY | Based MCP/PoP Products |
| S72WS512NFG-LZ | Based MCP/PoP Products |
| S72WS512NFG-N5 | Based MCP/PoP Products |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| S72WS512NFG-L7 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Based MCP/PoP Products |
| S72WS512NFG-LW | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Based MCP/PoP Products |
| S72WS512NFG-LY | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Based MCP/PoP Products |
| S72WS512NFG-LZ | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Based MCP/PoP Products |
| S72WS512NFG-N5 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Based MCP/PoP Products |
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