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參數(shù)資料
| 型號： | S72NS512PE0AHGL02 |
| 廠商： | SPANSION LLC |
| 元件分類： | 存儲器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA133 |
| 封裝： | 11 X 10 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 |
| 文件頁數(shù)： | 2/14頁 |
| 文件大?。?/td> | 771K |
| 代理商： | S72NS512PE0AHGL02 |
10
S72NS-P MCP/PoP Memory System Solutions
S72NS-P_00_07 September 24, 2008
Data
Sheet
(Adv an ce
Inf o r m a t io n)
6.
Physical Dimensions
6.1
NLC133—133-ball Fine-Pitch Ball Grid Array (FBGA) 11.0 x 10.0 mm
3436 \ 16-039.22 \ 12.09.04
PACKAGE
NLC 133
JEDEC
N/A
D x E
11.0 mm x 10.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
0.90
1.00
1.10
PROFILE
A1
0.20
0.25
0.30
BALL HEIGHT
A2
0.70
0.76
0.82
BODY THICKNESS
D
10.9
11.0
11.1
BODY SIZE
E
9.9
10.0
10.1
BODY SIZE
D1
6.50 BSC.
MATRIX FOOTPRINT
E1
6.50 BSC.
MATRIX FOOTPRINT
MD
14
MATRIX SIZE D DIRECTION
ME
14
MATRIX SIZE E DIRECTION
n
133
BALL COUNT
b
0.25
0.30
0.35
BALL DIAMETER
eE
0.50 BSC.
BALL PITCH
eD
0.50 BSC
BALL PITCH
SD / SE
0.25 BSC.
SOLDER BALL PLACEMENT
D5-D11, E4-E11, F4-F11
DEPOPULATED SOLDER BALLS
G4-G11, H4-H11, J4-J11
K4-K11, L4-L11
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
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