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參數(shù)資料
| 型號(hào)： | S71WS512ND0BFWY32 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁(yè)數(shù)： | 45/188頁(yè) |
| 文件大小： | 2252K |
| 代理商： | S71WS512ND0BFWY32 |
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September 15, 2005 S71WS-N_01_A4
S71WS-Nx0 Based MCPs
43
A d v a n c e I n f o r m a t i o n
After the erase operation has been suspended, the bank enters the erase-suspend-read mode.
The system can read data from or program data to any sector not selected for erasure. (The de-
vice “erase suspends” all sectors selected for erasure.) Reading at any address within erase-
suspended sectors produces status information on DQ7-DQ0. The system can use DQ7, or DQ6,
and DQ2 together, to determine if a sector is actively erasing or is erase-suspended. Refer to
Table 10.20
for information on these status bits.
After an erase-suspended program operation is complete, the bank returns to the erase-suspend-
read mode. The system can determine the status of the program operation using the DQ7 or DQ6
status bits, just as in the standard program operation.
In the erase-suspend-read mode, the system can also issue the Autoselect command sequence.
Refer to the “Write Buffer Programming Operation” section and the “Autoselect Command Se-
quence” section for details.
To resume the sector erase operation, the system must write the Erase Resume command. The
bank address of the erase-suspended bank is required when writing this command. Further writes
of the Resume command are ignored. Another Erase Suspend command can be written after the
chip has resumed erasing.
The following is a C source code example of using the erase suspend function. Refer to the
Spansion Low Level Driver User’s Guide
(available on www.amd.com and www.fujitsu.com)
for general information on Spansion Flash memory software development guidelines.
/* Example: Erase suspend command */
*( (UINT16 *)bank_addr + 0x000 ) = 0x00B0; /* write suspend command */
The following is a C source code example of using the erase resume function. Refer to the
Spansion Low Level Driver User’s Guide
(available on www.amd.com and www.fujitsu.com)
for general information on Spansion Flash memory software development guidelines.
/* Example: Erase resume command */
*( (UINT16 *)bank_addr + 0x000 ) = 0x0030; /* write resume command */
/* The flash needs adequate time in the resume state */
10.5.6
Program Suspend/ Program Resume Commands
The Program Suspend command allows the system to interrupt an embedded programming op-
eration or a “Write to Buffer” programming operation so that data can read from any non-
suspended sector. When the Program Suspend command is written during a programming pro-
cess, the device halts the programming operation within t
PSL
(program suspend latency) and
updates the status bits. Addresses are “don't-cares” when writing the Program Suspend
command.
After the programming operation has been suspended, the system can read array data from any
non-suspended sector. The Program Suspend command may also be issued during a program-
ming operation while an erase is suspended. In this case, data may be read from any addresses
not in Erase Suspend or Program Suspend. If a read is needed from the Secured Silicon Sector
area, then user must use the proper command sequences to enter and exit this region.
Table 10.17 Software Functions and Sample Code
Cycle
Operation
Byte Address
Word Address
Data
1
Write
Bank Address
Bank Address
00B0h
Cycle
Operation
Byte Address
Word Address
Data
1
Write
Bank Address
Bank Address
0030h
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S71WS512ND0BFWY33 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY60 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY62 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY63 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY70 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S71WS512ND0BFWY33 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY60 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY62 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY63 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY70 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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