型號(hào): | S71WS512ND0BFWE20 |
廠商: | SPANSION LLC |
元件分類: | 存儲(chǔ)器 |
英文描述: | Stacked Multi-Chip Product (MCP) |
中文描述: | SPECIALTY MEMORY CIRCUIT, PBGA84 |
封裝: | 12 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84 |
文件頁數(shù): | 1/188頁 |
文件大?。?/td> | 2252K |
代理商: | S71WS512ND0BFWE20 |
相關(guān)PDF資料 |
PDF描述 |
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S71WS512ND0BFWE22 | Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE23 | Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE30 | Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE32 | Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE33 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
---|---|
S71WS512ND0BFWE22 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE23 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE30 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE32 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE33 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |