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參數(shù)資料
| 型號： | S71WS512ND0BFWAP3 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁數(shù)： | 1/13頁 |
| 文件大小： | 186K |
| 代理商： | S71WS512ND0BFWAP3 |
Publication Number
S71WS-N_00
Revision
A
Amendment
6
Issue Date
July 19, 2006
S71WS-N
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM
S71WS-N Cover Sheet
Data Sheet
(Advance Information)
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
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| S71WS512ND0BFWE20 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWE22 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWE23 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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| S71WS512ND0BFWE32 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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