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參數(shù)資料
| 型號： | S71WS512ND0BAWTN0 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁數(shù)： | 10/13頁 |
| 文件大?。?/td> | 186K |
| 代理商： | S71WS512ND0BAWTN0 |
8
S71WS-N
S71WS-N_00_A6 July 19, 2006
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
5.3.2
FTA084—84-ball Fine-Pitch Ball Grid Array (FBGA) 11.6 x 8.0 x 1.4 mm
3388 \ 16-038.21a
PACKAGE
FTA 084
JEDEC
N/A
D x E
11.60 mm x 8.00 mm
PACKAGE
NOTE
SYMBOL
MIN
NOM
MAX
A
---
---
1.40
PROFILE
A1
0.17
---
---
BALL HEIGHT
A2
1.02
---
1.17
BODY THICKNESS
D
11.60 BSC.
BODY SIZE
E
8.00 BSC.
BODY SIZE
D1
8.80 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
12
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
φ
b
eE
84
BALL COUNT
0.35
0.40
0.45
BALL DIAMETER
0.80 BSC.
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
A2,A3,A4,A5,A6,A7,A8,A9
B1,B10,C1,C10,D1,D10,E1,E10
F1,F10,G1,G10,H1,H10
J1,J10,K1,K10,L1,L10
M2,M3,M4,M5,M6,M7,M8,M9
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
(2X)
C
0.08
0.20
C
C
6
b
SIDE VIEW
84X
A1
A2
A
0.15 M C
0.08
M C
A B
BOTTOM VIEW
M L
E1
7
SE
A
D1
eD
D
C
E
F
G
H
J
K
10
9
8
7
6
4
3
2
1
eE
5
B
PIN A1
CORNER
7
SD
A
E
B
C
0.15
D
C
0.15
(2X)
INDEX MARK
10
TOP VIEW
CORNER
PIN A1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S71WS512ND0BAWTN2 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWTN3 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWTP0 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWTP2 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWTP3 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S71WS512ND0BAWTN2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWTN3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWTP0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWTP2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWTP3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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