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參數(shù)資料
| 型號： | S71WS512ND0 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁數(shù)： | 4/13頁 |
| 文件大?。?/td> | 186K |
| 代理商： | S71WS512ND0 |
2
S71WS-N
S71WS-N_00_A6 July 19, 2006
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
1.
Product Selector Guide
Note:
0 (Protected), 1 (Unprotected [Default State])
Device
Model
Numbers
Flash
pSRAM
Density
(Mb)
Flash
Speed
(MHz)
pSRAM
Speed
(MHz)
DYB
Power-Up
State
(
See Note
)
pSRAM
(Cellular RAM)
Supplier
Package
(mm)
S71WS128NB0
AK
WS128N
32
54
54
0
2
8.0X11.6X1.2
AP
1
AJ
66
66
0
AN
1
AH
80
80
0
AM
1
S71WS128NC0
AK
WS128N
64
54
54
0
2
8.0X11.6X1.2
AP
1
AJ
66
66
0
AN
1
AH
80
80
0
AM
1
S71WS256NC0
AK
WS256N
64
54
54
0
2
11.6x8.0x1.2
AP
1
AJ
66
66
0
2
AN
1
AH
80
80
0
2
AM
1
S71WS256ND0
YK
128
54
54
0
2
9x12x1.2
YP
1
YJ
66
66
0
YN
1
YH
80
80
0
YM
1
S71WS512NC0
AK
WS512N
64
54
54
0
2
11.6x8.0x1.2
AP
1
TJ
66
66
0
2
11.6x8.0x1.4
TN
1
TH
80
80
0
2
TM
1
S71WS512ND0
EK
128
54
54
0
2
9x12x1.4
EP
1
EJ
66
66
0
EN
1
EH
80
80
0
EM
1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S71WS512ND0BAWAJ0 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWAJ2 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWAJ3 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWAK0 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWAK2 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S71WS512ND0BAWA20 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWA22 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWA23 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWA30 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWA32 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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