采購需求
(若只采購一條型號(hào),填寫一行即可)*型號(hào) | *數(shù)量 | 廠商 | 批號(hào) | 封裝 |
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型號(hào): | S71WS512NC0BFWTP3 |
廠商: | Spansion Inc. |
英文描述: | Stacked Multi-Chip Product (MCP) |
中文描述: | 堆疊式多芯片產(chǎn)品(MCP) |
文件頁數(shù): | 1/13頁 |
文件大?。?/td> | 186K |
代理商: | S71WS512NC0BFWTP3 |
相關(guān)PDF資料 |
PDF描述 |
---|---|
S71WS512NC0BFWYJ0 | Stacked Multi-Chip Product (MCP) |
S71WS512NC0BFWYJ2 | Stacked Multi-Chip Product (MCP) |
S71WS512NC0BFWYJ3 | Stacked Multi-Chip Product (MCP) |
S71WS512NC0BFWYK0 | Stacked Multi-Chip Product (MCP) |
S71WS512NC0BFWYK2 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
---|---|
S71WS512NC0BFWY20 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71WS512NC0BFWY22 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71WS512NC0BFWY23 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71WS512NC0BFWY30 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71WS512NC0BFWY32 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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