參數(shù)資料
型號(hào)： S71GL064A04BFI0B2
廠商： Spansion Inc.
英文描述： Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述： 堆疊式多芯片產(chǎn)品（MCP）的閃存和RAM
文件頁(yè)數(shù)： 47/102頁(yè)
文件大?。?/td> 1606K
代理商： S71GL064A04BFI0B2
March 31, 2005 S71GL032A_00_A0
S71GL032A Based MCPs
49
Advance
Informatio n
Notes:
1. When Sector Address is specified, any address in the selected sector is acceptable. However, when loading Write-Buffer
address locations with data, all addresses must fall within the selected Write-Buffer Page.
2. DQ7 may change simultaneously with DQ5. Therefore, DQ7 should be verified.
3. If this flowchart location was reached because DQ5= “1”, then the device FAILED. If this flowchart location was reached
because DQ1= “1”, then the Write to Buffer operation was ABORTED. In either case, the proper reset command must be
written before the device can begin another operation. If DQ1=1, write the Write-Buffer-Programming-Abort-Reset
command. if DQ5=1, write the Reset command.
4. See Table 22 for command sequences required for write buffer programming.
Figure 3. Write Buffer Programming Operation
Write “Write to Buffer”
command and
Sector Address
Write number of addresses
to program minus 1(WC)
and Sector Address
Write program buffer to
flash sector address
Write first address/data
Write to a different
sector address
FAIL or ABORT
PASS
Read DQ7 - DQ0 at
Last Loaded Address
Read DQ7 - DQ0 with
address = Last Loaded
Address
Write next address/data pair
WC = WC - 1
WC = 0 ?
Part of “Write to Buffer”
Command Sequence
Yes
No
Abort Write to
Buffer Operation?
DQ7 = Data?
DQ5 = 1?
DQ1 = 1?
Write to buffer ABORTED.
Must write “Write-to-buffer
Abort Reset” command
sequence to return
to read mode.
(Note 2)
(Note 3)
(Note 1)
相關(guān)PDF資料
PDF描述
S71GL064A04BFI0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFI0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFI0F2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFW0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFW0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S71GL064A04BFI0B3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFI0F0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFI0F2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFI0F3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFW0B0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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